Memory system having flexible bus structure and method

ABSTRACT

A memory system having a memory controller connected to multiple memory devices by way of a system bus. The memory controller issues device select, memory program and memory read instructions for the memory devices over the system bus, with the device select instructions including a device select address and a device select command. The memory devices each include an array of memory cells and a memory operation manager which functions to carry out memory read and program operations on the array. The memory operation manager includes an address comparator which compares the device select address received on the system bus with a local address stored in the memory device and a command decoder which detects commands on the system bus, with the memory operation manager operating to switch the memory device from a device-disabled state to a device-enabled state when the memory device receive a select address which matches the local address together with one of the device select commands.

This application is a Divisional of U.S. Ser. No. 09/351,879 filed Jul.13, 1999 now U.S. Pat. No. 6,212,123 which is a Continuation of U.S.Ser. No. 08/847,641 filed Apr. 23, 1997 now issued as U.S. Pat. No.6,021,459 on Feb. 2, 2000.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to semiconductor memory systemsand in particular to a memory system of the type having a singlecontroller and multiple memory devices communicating with the controllerby way of a flexible bus structure that permits the system toaccommodate a wide number and variety of memory devices.

2. Description of Related Art

Semiconductor memories having increased storage capacity have beendeveloped. A typical memory system may include a single memorycontroller implemented on a single integrated circuit together with oneor more memory devices, each of which is implemented on a singleintegrated circuit, having an array of memory cells. The memorycontroller and memory devices are typically connected by way of a bus sothat the controller can issue memory read, program and erase commands toa selected one of the memory devices.

In order to increase the storage capacity of a memory system, it ispossible that a large number of separate integrated circuit memorydevices may be utilized in the system. However, a typical memory systembus includes an address bus, a data bus and various control pins such asChip Enable (CE), Output Enable (OE), Write Enable (WE) and the like.This type of configuration increases the pin count of the integratedcircuit memory devices and power requirements. Further, the use ofseparate control pins for each integrated circuit memory deviceincreased the complexity of the system bussing.

A memory system-of the type having a memory controller and a pluralityof separate memory devices which share the same flexible bus structurewould be highly desirous. Ideally, such a system would allow the samearchitecture for different storage capacities and would permit bothforward and backward flexibility so that so that several generations ofthe separate memory devices can operate at the same time with the samecontroller. Further, the system would allow memory devices to be usedhaving a reduced pin count so an to reduce complexity, manufacturingcosts and increase relaility.

The present invention provides the above-noted advantages as will berecognized by those skilled in the art upon a reading of the followingDetailed Description of the Preferred Embodiment together with thedrawings.

FIG. 1 depicts a simplified conventional memory system which includes ahost device 20, an address decoder 22 and memory devices 24A and 24B.The host device 22 may be a microprocessor and the memory devices 24Aand 24B may be separate memory integrated circuits. An address bus 26 isused to provide addresses to an address decoder 22 and to the memorydevices 24A and 24B. The address decoder 22 has two outputs connected toenable inputs of the memory devices 24A and 24B. Typically, the mostsignificant bit(s) of the address are provided on the bus 26 to thedecoder 22, with the remaining address bits being provided to each ofthe memory devices.

When memory is to be accessed, the processor 20 causes the addressdecoder 22 to decode the most significant bit(s) of the memory addressplaced on an address bus 26. The decoder 22 will select one of the twomemory devices 24A and 24B by generating either signal Sel 0 or Sel 1.The selected memory device will respond to the address presented to iton the address bus and the deselected memory device, which is disabled,will not respond. Although not shown, a data bus is used to transferdata between the memory devices and the processor 20, with only theselected device outputting data to the data bus during memory readoperations.

The approach depicted in FIG. 1 is sometimes referred to as radialdevice selection where each memory device has a separate select input.This approach works well when relatively few memory devices are employedand where access speed, particularly random access speed, is important.However, if a large number of memory devices are used so that largeamounts of data can be stored, the requirement of separate select linesfor each memory device results in large memory boards and a relativelylarge pin count for the control logic circuitry. Thus, unless accessspeed is critical and a large number of memory devices are used, theradial device selection approach of FIG. 1 is not ideal.

FIG. 2 shows an alternative prior art device selection technique,sometimes referred to as serial selection. Again, a host device 28 isused which is connected to several memory devices 30A, 30B and 30C byway of a system bus 32. The memory devices 30A, 30B and 30C are usuallyimplemented as separate integrated circuits. The system bus 32 includesmemory address and memory data and various control signals so that eachof the memory devices 30A, 30B 30C receives the same addresses, data andother signals. Each memory device is preassigned a unique address sothat only one device will be accessed by the host device 28 during amemory operation. Typically, the memory devices 30A, 30D and 30C areassigned addressee by way of jumper or switch settings represented byelements 34A, 34B and 34C.

The FIG. 2 approach requires that dedicated pins be provided on each ofthe integrated circuit memory devices 30A, 30B and 30C to receive thejumper wires or switches for assigning the addresses. These pinsincrease the pin count for the integrated circuits thereby increasingthe cost of the packaging for the devices and increasing the likelihoodthat there will be mechanical problems and manufacturing errors throughsoldering and the like. These extra pins are also subject to defects andincrease the possibility of damage to the integrated circuits as aresult of electrostatic discharge.

SUMMARY OF THE INVENTION

A memory system comprising a memory controller and a plurality of memorydevices coupled to a common system bus is disclosed. The memorycontroller is configured to issue device select instructions, memoryprogram instructions and memory read instructions over the system bus.The device select instructions include a device select command and adevice select address.

The memory devices are each switchable between a device-enabled statewhere memory read operations can be carried out on the memory device anda device-disabled state where memory read operations cannot be carriedout. Each of the memory devices further includes an array of memorycells and a memory operation manager coupled to the system bus and tothe array. The memory operation manager, which is configured to carryout the memory read and memory program operations, includes an addresscomparator configured to compare a local address for the memory deviceto an address received from the memory controller on the system bus anda command decoder configured to detect commands received from the memorycontroller on the system bus. The memory operation manager is furtherconfigured to switch the memory device to the device-enabled state whencommand decoder and address comparator indicate that one of the deviceselect commands has been detected on the system bus together with anaddress on the system bus which matches the local address.

Preferably, the memory controller is configured to issue a devicedeselect command on the system bus together with a device deselectaddress on the system bus. In that event, the memory operation manageris further configured to switch the memory device to the device-disabledstate when the command decoder and address comparator indicate that oneof the device deselect command has been detected on the system bustogether with the device deselect address on the system bus whichmatches the local address.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a simplified block diagram of a prior art memory system usingradial selection techniques.

FIG. 2 is a simplified block diagram of a prior art memory system usinga serial selection technique.

FIG. 3A is a simplified block diagram of a memory system suitable foraccommodating the present invention showing multiple memory devices anda common controller.

FIG. 3B is a simplified block diagram of an alternate embodiment memorysystem also suitable for accommodating the present invention showingmultiple memory devices arranged in banks.

FIG. 4 is a block diagram of the interface circuitry used in the memorydevices of the FIG. 3A and 3B memory systems.

FIG. 5 is a schematic diagram showing details of the interface circuitryof FIG. 4.

FIG. 6 is a truth table relating to the select logic of the FIG. 4 and 5diagrams.

FIG. 7 is a truth table relating to the command decoder circuitry of theFIG. 4 and 5 diagrams.

FIG. 8A is a timing diagram showing the relationship for the signals onthe Tag Bus, Data Bus and the Strobe signal on the FIG. 3A and 3B blockdiagrams illustrating the manner in which addresses are assigned to twoof the memory devices.

FIG. 8B is a timing diagram showing the relationship for the signals onthe Tag Bus, Data Bus and the Strobe signal on the FIG. 3A and 3B blockdiagrams illustrating the manner in which the memory devices areselected and deselected in accordance with one aspect of the presentinvention.

FIG. 9 is block diagram showing the organization of the memory flashcell array for each of the FIG. 3A and FIG. 3B Memory Devices 38.

FIG. 10 is a more detailed diagram of the Command Decoder Logic blockand of the Register block of the FIG. 4 interface circuitry.

FIG. 11 is a truth table for the Command Decoder Logic block of the FIG.4 interface circuitry.

FIGS. 12A-12N are diagrams representing exemplary interface registersused in carrying out various memory operations.

FIG. 13 is a flow chart illustrating the sequence for assigningaddresses to the memory devices.

FIG. 14 is a flow chart depicting the sequence for selecting one of thememory devices.

FIG. 15 is a flow chart depicting the sequence for deselecting one ofthe memory devices.

FIG. 16 is a flow chart illustrating the manner in which an exemplarymemory read operation is carried out.

FIG. 17 is a schematic diagram of the sense amplifier and associatedcircuitry of the individual Memory Devices 38 of FIGS. 3A and 3B.

FIGS. 18A and 18B are a flow chart illustrating an exemplary ProgramOperation for the FIG. 3A and 3B memory systems.

FIG. 19 is a schematic diagram showing additional details of the ProgramLatch of FIG. 16.

FIGS. 20A and 20B are a flow chart illustrating an exemplary EraseOperation for the FIG. 3A and 3B memory system.

FIG. 21 is a schematic diagram of one of the control registers used tocontrol operation of the memory device together with associated decodercircuitry.

FIG. 22 is a schematic diagram of the Byte Address Counter andassociated circuitry.

FIG. 23 is a schematic diagram of the Packet Address Counter andassociated circuitry.

FIGS. 24A and 24B are block diagrams of the charge pump circuits used toprovide the various voltages used in carrying out memory read, program,erase and other operations.

FIG. 25 is a timing diagram illustrating the operation the Memory Deviceresponding to a read command.

FIG. 26 is a schematic diagram of the Program Data Registers which holdthe data to be programmed into the memory and the associated decodercircuitry.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Referring again to the drawings, FIG. 3A is a simplified block diagramof an embodiment of a memory system in accordance with certain aspectsof the present invention. The exemplary memory system to be described isa mass storage memory system used to emulate the operation of a harddisc drive. It should be noted, however, that the subject invention issuitable for use in a large variety of other applications.

The memory system includes a Controller 36 and a plurality of memorydevices 38A, 38B and 36C. The Controller 36 can be implemented using awide variety of techniques including ASIC (Application SpecificIntegated Circuit) technology. The Controller 36 is best understood bydescribing its functionality, with the particular implementation formingno part of the present invention. Since the Controller can be readilyconstructed by persons of ordinary skill in the art based upon thefollowing functional description, details regarding a particularimplementation will not be provided so as to avoid obscuring the truenature of the present invention in unnecessary detail.

The memory devices 34A, 38B and 36C are preferably separate integratedcircuits utilizing non-volatile memory technology. The exemplaryembodiment will be described using flash memory technology, that beingthe preferred memory technology. Each Memory Device 38A, 38B, and 38C iscapable of storing a substantial amount of data such as forty Megabits.Several memory devices can be added to the memory system to increase thestorage capacity.

In order to reduce the cost of adding memory devices to the system, itis desirable to maximize the amount of memory control functionsperformed by the Controller 36 and to minimize the number of suchfunctions performed by the Memory Devices 38. Among other things, thisapproach tends to minimize the use of duplicative control circuitry andfurther provides increased design flexibility, as will become apparent.Further, the number of pins on the Memory Devices 38 is minimized.

Controller 36 communicates with the memory devices 38A, 38B and 38C byway of a Tag Bus 40, a Data Bus 42, a Strobe Line 44 and a series ofSelect Lines 46A, 46B and 46C. An will be explained in greater detail,the Tag Bus 40 functions to transfer commands originating from aController 36 to one or all of the Memory Devices 38. The Data Bus 42functions to transfer memory data between the Controller 36 and theMemory Devices 38 and to transfer control information to the MemoryDevices 38 which, together with commands on the Tag Bus 40, is used toperform several memory functions. For the disclosed exemplaryimplementation, the Tag Bus 40 is five bits wide and the Data Bus 42 iseight hits wide The Strobe Line 44 generally functions to provide astrobe signal originating with the Controller 36 to the Memory Devices38 so that the Devices can strobe (clock) data present on the Tag Bus 40and Data Bus 42. The Strobe Signal acts as a master clock which allowsdata on the two buses to be transferred only when action is to be taken.This approach is preferred over the use of a free ring clock interfacewhich tends to consume power and generate noise. As will becomeapparent, this set of interface lines allows all memory functions to becarried out, with the interface lines being the same regardless of thenumber of Memory Devices 38 being used.

As will be explained in greater detail, the Memory Devices 38 areassigned unique addresses by controller 36 each time the memory systemis powered up or after the system has been reset. This must occur beforethe memory system is operational as a memory However, as will beexplained in greater detail, it is possible to access and use the MemoryDevice 38A, connected directly to Controller 36 by Select Line 46A,without having assigned addresses for any of the Memory Devices 38, Theaddress assignments occur serially, with the Memory Device 38A, beingassigned the first address, such as address 0001. This address is storedin Device 38A and will be used to decode addresses present on the DataBus 42 during normal memory operations. Once Device 38A has beenassigned an address, the next device, Device 38B in assigned an address,such as address 00010. This process will continue until each of theMemory Devices 38 is assigned a unique address. At that point,Controller 36 is capable of communicating with all or a selected one ofthe Memory Devices so that normal memory operations can take place suchas memory reading and writing. The circuitry for carrying out thesequence for assigning addresses to the Memory Devices 38 will now bedescribed.

FIG. 4 is a simplified diagram of the interface circuitry present ineach of the Memory Devices 38. Although Device 38A connected to Selectline 46A coming directly from Controller 36 is depicted, this being thefirst Memory Device 38 to be assigned an address, the interfacecircuitry is identical for all of the Devices 38. The Tag Bus 40 isconnected to the Memory Device by way of five integrated circuit pads(not depicted) which are electrically connected to five separate InputBuffers represented by block 48. The Input Buffers can be enabled ordisabled by a combination of Input Enable (IEN) and Out/In (O/I) signalsgenerated within the Device 38 depending upon various conditions to bedescribed. An Input Buffer 50 is also provided for receiving the StrobeLine 44 by way of an integrated circuit pad (not depicted), with Buffer50 also being controlled by the internal Input Enable and Out/Insignals. A further Input Buffer 51 is provided for receiving the Selectsignal on line 46A. Buffer 51 is permanently enabled.

The Data Bus 42 is connected to an I/O Buffer & DL Pass Logic block 52which represents eight separate bi-directional buffer circuits connectedto separate ones of the lines of the Data Bus 42. Block 52 furtherrepresents bypass circuitry which can be used to bypass the buffercircuits so that the bit lines of the memory array can be accesseddirectly for testing purposes.

Block 52 is controlled by a combination of signal Input Enable (IEN) andout/In (O/I). As will be explained in greater detail, the Memory Devices38 will be outputting data when a Tag 19H is present on the Tag Bus 40thereby indicating that data is to be read out of the Device. That datawill be provided on DL bus 55 containing data read from the memoryarray. When a Tag 1A is on the Tag Bus 40, the contents of a ControlRegister are to be read out of the Device. That data will be provided byway of Register Data bus 59. Generally speaking, signal Out/In (O/I) isactive when either Tag 19 or Tag 1A are present. When Out/In is activeand signal Input Enable (IEN) is active, Buffer 52 functions to outputdata from the Device (either memory data or control register data) tothe Data Bus 42. When Out/In is inactive and signal Input Enable (IEN)is active, Buffer 52 functions to transfer data on the Data Bus 42 toInput Data bus 54 of the Memory Device 38. When signal Input Enable(IEN) is inactive, Buffer 52 is disabled and does not transfer data ineither direction. Input buffers 48 and 50 are enabled when signal InputEnable (IEN) is active.

DL Bus 55 functions to forward data to be programmed is to the memoryarray. In addition, data read from the memory array is placed in the DLBus 55 and forwarded to the I/O Buffers & DL Pass Logic block 52 by wayof Output Multiplexer 57. Multiplexer 57 also receives data from thevarious registers in Register Block 66 by way of a Register Data bus 59so that the contents of these registers can be read out. Multiplexer 57is controlled so as to select either the data on the Dt Bus 55 orRegister bus 59.

As will be explained in greater detail, the data placed on Data Bus 42by Controller 36 and received by the I/O Buffer and DL Pass Logic block52 is used in a wide variety of memory operations. Those include memoryread, program and erase operations. The data received on Data Bus 42 isalso used in conjunction with various commands present on the Tag Bus 40for performing various memory operations, including the initialassignment of addresses to each of the Memory Devices 36. The circuitryassociated with decoding commands on the Tag Bus 40 and associated datafrom the Data Bus 42 on lines 58 is represented by Command Decode Logicblock 62.

Some of the circuitry used for the initial assignment of addresses isaccomplished by circuitry represented by Select Logic block 64. SelectLogic block 64 provides a large number of control signals to besubsequently described, including signal Sel Out 0 on line 46B, by wayof a buffer 68. As noted in connection with FIG. 3A, the signal Sel Outare generated by each of the Memory Devices 38 and forwarded to theadjacent Memory Device 38 during the initial sequence of assigningaddresses. In addition, the Select Logic block 64 generates signal InputEnable (IEN) used by Input Buffers 48 and 50.

Most of the memory functions are carried out utilizing an array ofregisters represented by Register Block 66. Among other things, RegisterBlock 66 provides the addresses used by the memory in read andprogramming operations. In addition, Register Block 66 is used tocontrol the various voltages used in memory operations, as will beexplained in greater detail.

FIG. 5 in a moire detailed diagram of the select logic circuitry fromthe interfaces diagram of FIG. 4 used for, among other things, theinitial selection of Memory Device 3B addresses. FIG. 6 is a SelectLogic Table, a form of truth table, which depicts the various inputs tothe FIG. 5 circuitry and the corresponding state of various latches orflip-flops. The Tag Bus column of the Select Logic Table shows certainselected Tag Bus 40 inputs that relate to the operation of the selectlogic circuitry. The Tag Bus inputs comprise five bits that are shownusing Hexadecimal notation. The next column shows the state of the eightbits that are present on the Data Bus 42, namely bits D0-D7.

The next column of the Select Logic table shows the output {overscore(L)}ow {overscore (V)}cc produced by a Power On Reset circuit 70. Signal{overscore (L)}ow {overscore (V)}cc is at a low (“0”) state when theprimary memory supply voltage Vcc is below a predetermined operatinglevel and is momentarily low when the primary supply Vcc is first turnedon. The next column is signal Lock Out (LOUT) which is stored in a latchrepresented by JK flip-flop 72. As will be explained, signal Lock Out isused for many memory functions including the prevention of thealteration of the Memory Device 38 address stored in an Address is IDLatch 78 once an address has been-assigned. Flip-flop 72 can be said tobe in a lockout state when signal Lock Out is active and in anon-lockout state when the signal is inactive. Continuing, signal DevSel, which is stored in a latch represented by JK flip-flop 74,functions to permit the associated Memory Device 38 to respond to memoryread and write commands originating from the Controller 36. When signalDev Sel is active, the flip-flop 74 is said to be in a device-selectedstate and when the signal is inactive, flip-flop 74 in said to be in adevice-not-selected state.

The next column of the Select Logic table shows signal Sleep (or SLP)produced by flip-flop 71. As will be explained in greater detail, whensignal Sleep is active, the Memory Device is in a low power state withessentially all circuitry, including the control registers that make upRegister Block 66 (FIG. 4), being in a reset state except for theAddress ID Latch 78. Since Latch 78 is not reset, it is possible toswitch the Memory Device from this sleep mode to an operational modewithout the necessity of reassigning addresses.

The Memory Device 38 is in a reset state when Lock Out latch 72, Deviceselect latch 74, Sleep latch 71 and Address ID latch 78 are reset. Inaddition, the various control registers which make up Register Block 66are reset. Thus, the reset state is similar to the sleep state exceptthat the Address ID latch 78 is reset so that the Memory Device must gothrough an initial address assignment after entry into the reset stateif the memory is to be used in the serial selection configuration. Ancan be seen from the table of FIG. 6, the Memory Device can be caused toenter the reset state in various ways. By way of example, when theMemory Device is powered up, the Power On Reset circuit 70 will issuesignal {overscore (L)}ow {overscore (V)}cc (“0”) thereby causing theappropriate circuitry to be reset. Other techniques to cause entry intothe reset State, such as the use of Tag Commands, will be describedlater.

As will also be explained in greater detail, the Memory Devices 38 areswitchable between a device-enabled state and a device-disabled state.When in the device-enabled state, the Memory Device 38 is capable ofcarrying out memory operations, such as memory read, erase and programoperations. Memory Device 38 is in the device-enabled state under twoconditions: (1) signal Sel In is active and Signal Lock Out is inactive,that is, flip-flop 72 is the non-lockout state and (2) signal Dev Sel isactive, that is, flip-flop 74 is in the device-enabled state and signalLock Out is active, that is, flip-flop 72 is in the lockout state andsignal SLP is inactive, that is, flip-flop 71 is in a non-sleep state.

Condition (1) permits the Memory Device 38 to become operative at poweron, when flip-flop 72 is reset, by simply making signal Sel In active.There is no need, for example, to provide the Memory Device with a localaddress stored in the Address ID Latch 78. Since Sel In is connected toan external pin, it is possible to fully test a large number of theMemory Devices with a simple test fixture. Further, condition (1)operation makes it possible to configure the Memory Devices 38 in aradial manner such as depicted in FIG. 1 in addition to the serialselection configuration of FIG. 3A. There is no need to make an initialaddress assignment.

In addition, when using the serial selection configuration of FIG. 3A,it is possible to use the Memory Device 38A connected directly toController 36 as a boot memory which can be accessed directly byController 36 at power on so that the Controller can read a boot codestored in Device 38A using the Sel In 0 signal. Among other things, thatboot code could be used to carry out address assignment sequence uponcompletion of which permits the Memory Devices to enter Condition (2).

Condition 2 in entered, as will be explained, once a local address hasbeen loaded into the Address ID Latch and the Memory Device has beenaddressed by the

Memory Controller 36 by placement of One local address on the Data Bus.Thus, condition (2) is used primarily for normal operations, as opposedto testing operations.

Signal Match is generated by a comparator circuit 76 which comparesseven bits of address stored in an Address ID Latch 78 with seven bitsof address coming from the Input Buffer 52A connected to Data Bus(D0-D6). It should be noted that Input Buffer 52A of FIG. 5 is part ofthe I/O Buffer and DL Pass Logic 52 of FIG. 4 with 52A representing onlythe data input function of Buffer 52. As previously noted, Buffer 52(52A) will function to input data only it signal Out/In is inactive (not[Tag 19 or Tag 1A]) and signal Input Enable (IEN) is active. When signalOut/In is active or signal Input Enable (IEN) is inactive, circuit 52 isdisabled with respect to incoming signals on Data Bus 42. When signalOut/In is active and signal IEN active, circuit 52 is enabled to inputsignals on the Data Bus.

As will be explained in greater detail, the Address ID Latch 78 storesthe unique address assigned by the Controller 36 to the associatedMemory Device 38. This address is sometimes referred to as a localaddress.

FIG. 7 is an Enable & Select out Logic truth table having input signals{overscore (L)}ow {overscore (V)}cc ({overscore (LVCC)}), Lock out(LOUT), Dev Sel (DSEL) and Sleep (SLP) previously noted in connectionwith FIG. 6. The outputs include the previously noted signal InputEnable (IEN) which is produced by OR gate 80 of the FIG. 5 circuitdiagram. Signal Input Enable functions, among other things, to enablethe Input Buffers 48 and 50 so that signal Strobe can be received and sothat the contents of the Tag bus 40 can be received. Buffer 52A (FIG. 5)associated with the Data Bus will also be enabled provided that signalOut/In is inactive (not [Tag 19 or Tag 1A]), the Strobe Input and theData Bus, respectively.

Continuing, signal Sel Out is outputted by buffer 68 once the subjectMemory Device 38 has completed the initial assignment of addresses. Aswill be explained, this permits the adjacent Memory Device 38 connectedto receive signal Sel Out to be assigned an initial address. SignalDecoder Enable (DEN) is produced by logic gate 82 and functions, amongother things, to enable a Local Tag Decoder 84 which is used to decodedata on the Tag Bus when the subject Memory Device 38 is being addressedfor memory read and program operations.

Further details regarding the manner in which the Controller 36 assignsaddresses to the multiple Memory Devices 38 will now be described. FIG.13 is a flow chart showing the address assignment sequence. In addition,FIG. 8A is a timing diagram illustrating a portion of the sequence forthe first two Memory Devices 38A and 38B.

At initial power on, the Power On Reset circuit 70 will cause variouselements of the interface circuitry to be initialized, as previouslydescribed. Signal {overscore (L)}ow {overscore (V)}cc, which is invertedby an inverter 85, will be at a low level so that the Address ID Latch78 for all of the Memory Devices 3B will be cleared by way of NOR gateas, inverter 83 and NOR gate 99. In addition, NOR gate 86 will clear thelatch 74 associated with signal Dev Sel and latch 72 associated withsignal Lock Out. This is confirmed by the FIG. 6 table which shows thatthe four latches are in the reset state when signal {overscore (L)}ow{overscore (V)}cc is low (“0”), regardless of the state of the remaininginput signals similarly, the table of FIG. 7 shows the state of signalsInput Enable (IEN), Sel Out (SOUT) and Decoder Enable (DEN) when signal{overscore (L)}ow {overscore (V)}cc is active (“0”).

As represented by blocks 152 and 154 of the FIG. 13 flow chart, It inpreferable that the system be reset using a dedicated reset command.This step, which will be described in greater detail, ensures that thelogic circuitry is in the desired initialized state at the beginning ofthe sequence.

Just prior to the initiation of the sequence to assign addresses by theController 36 (FIG. 3A), signal Sel In 0 on line 46A from the controlleris inactive (“0”). This can also be seen in the FIG. 8A timing diagram.As indicated by the table of FIG. 7, the second row indicates the stateof all of the Memory Devices 38A, 38B and 38C at this stage of thesequence. All of the Input Enable signals are the same state as Sel In,namely “0”. Thus, as can be seen from FIGS. 4 and 5, the strobe and TagBus Input Buffers 48 and 50 are disabled. As shown in FIG. 8A, whenController 36 initiates the sequence to assign addresses, the Controllercauses signal Sel In 0 on line 46A to go active (“1”). This step in thesequence is represented by element 156 of the FIG. 13 flow chart. SignalSel In 0 will remain active until the address assignment sequence iscompleted. As can be seen in FIG. 3A, line 46A is connected only toMemory Device 38A and none of the other Memory Devices. Thus, as againindicated by the second row of the table of FIG. 1, signal Sel In to theMemory Devices 38A will cause signal Input Enable to go active (“1”).That is because buffered signal Sel In applied to one input of OR gate80 which generates signal Input Enable. Thus, the Tag Bus, Strobe Inputand I/O Data buffers 48, 52A and 50 of Memory Device 38A, and only thatMemory Device, will be enabled. Memory Device 38A is thus in theabove-noted device-enabled state.

Although Controller 36 will continue with the local address assignmentsequence, it should be noted that the Memory Device 38A is now capableof carrying out memory operations, including memory read, program anderase operations. This important feature permits the Memory Devices 38to be connected radially as shown in FIG. 1 and without the necessity ofassigning addresses to any of the Devices. As previously noted, testingof the Memory Devices 38 is also facilitated by this feature since alarge number of Devices 38 can be easily placed in the device-enabledstate by simply making the Sel In pin of all of the Devices active. Inaddition, this feature permits first Memory Device 38A connecteddirectly to the Select In 0 signal generated by Controller 36 to be usedas a boot memory which contains the code to be used by Controller 36.Such boot memory may be used for, among other things, carrying out theremainder of the address assignment sequence. As will be explained laterin greater detail, it is possible to arrange the Memory Devices into aplurality of banks as shown in FIG. 3B, with each bank having a firstMemory Device 38A, 38AA and 38AB connected to a separate Sel In lineprovided by a Controller 36A. Continuing with the description of tsequence for assigning local addresses, as indicated by element 158 ofthe FIG. 13 flow chart, once signal Sel In is made active, Controller 36then places a seven bit address on Data Bus 42 which will be the address(local address) used by the Controller in the future to access MemoryDevice 38A. Typically, the first Memory Device 38A address in 00H, ascan be seen in the timing diagram of FIG. 8A. The Controller will alsoplace a unique set of five bits of data on the Tag Bus 40, much databeing referred as the ID Select Tag. In the present example, the IDSelect Tag is 08H. The table of FIG. 6, in the fourth row, sets forthsome of the features of the ID Select Tag (or simply Tag 08H).

Once the address has been loaded onto the Data Bus 42 and the ID SelectTag 08H has been loaded onto the Tag Bus 40, element 160 of the FIG. 13timing diagram indicates that Controller 36 generates a Strobe pulse online 44 connected to all of the Memory Devices. The timing relationshipbetween the data in the Data Bus and Tag Bus and the Strobe signal isdepicted in the FIG. 8A timing diagram.

As previously noted, only Memory Device 38A is capable of responding tothe Tag Bus, Data Bus and Strobe signal once only Memory Device 38A hasan active signal input Enable. The seven bits of address data on theData Bus are loaded Into the Address ID Latch 78 (FIG. 5) in parallel.This is accomplished by clocking the Latch 78 with the Strobe signal byway of AND gate 90 which is enabled by the output of an AND gate 96 tobe described. In addition, the ID Select Tag on the Tag Bus, Tag 08H, ispresented to a Global Tag Decoder 92 which is also clocked by signalStrobe.

Global Tag Decoder 92 is implemented to decode certain Memory Deviceselect commands including the Tag 08H. The function performed by some ofthe commands is modified by data present on the Data Bus, with such databeing coupled to the Global Tag Decoder 92 as can be seen by theconnection between Input Buffer 52A of FIG. 5. Some of these modifierbits can be seen in the FIG. 6 table. In the case of Tag 08H, data onthe data bus does not operate to modify the function performed by thetag. Rather, the data on the bus represents the address to be assignedto the Memory Device 38, as previously noted.

The Global Tag Decoder 92 decodes the Tag 08 and provides an output online 94 indicating the ID Select Tag (Tag 08H) has been detected on theTag Bus 40. As will be described later, a Local Tag Decoder 84 is alsoprovided which is used to decode the other commands associated withmemory read and program operations. Unlike the Global Tag Decoder 92,the Local Tag Decoder 84 is disabled until signal Decoder Enable isactive.

The Tag 08H decode on line 94, is connected to one input of AND gate 96having an output connected to the J input of Lock Out latch 72. Thesecond input of AND gate 96 receives signal {overscore (LOUT)} which isactive (“1”) at this point. Thus, Tag 08H functions to set the Lock OutLatch (flip-flop 72) so that signal Lock Out (LOUT) goes active. Thisoccurs on the falling edge of the Strobe signal generated in conjunctionwith Tag 08H. In addition, the output of AND gate 96 is furtherconnected to AND gate 90 so that the Strobe signal will further functionto clock the Address ID Latch 78 so that the address on the Data Buswill be loaded into Latch 78. When Lock Out goes active, the output ofAND gate 96 goes inactive so that the Strobe signal can no longer clockAddress ID Latch 78. Thus, the Latch 78 will not be altered bysubsequent Strobe signals so that the ID (local address) stored in thelatch is retained. In this state, the contents of the Address ID Latchcannot be altered except by a certain commands to be described later andexcept by the Power On Reset circuit 70.

In addition, the active signal Lock Out will enable AND gate 98 so thatthe signal Sel Out 0 on line 46B will go active (FIG. 8A). As can beseen in FIG. 3A, Sel Out 0 is forwarded to adjacent Memory Device 38Band functions as the Sel In signal for that device. As indicated byelement 162 of the FIG. 8A timing diagram, a determination is then madeas to whether all of the Memory Devices 38 in the system have beenassigned an address. This is accomplished by monitoring the state ofsignal Sel out N on line 46D (FIG. 3A). At this stage of the sequence,signal Sel Out N will be inactive thereby indicating that the lastMemory Device 38C has not yet been assigned an address.

The assignment sequence will then proceed to element 164 (FIG. 8A) whichindicates that Controller 36 will generate a new local address for thenext Memory Device 386. In the present example, the address is 01H. Thesequence will then return to element 15B (FIG. 13). The local address isplaced on the Data Bus 42 and Tag 08H is placed on the Tag Bus 40. Notethat only Memory Device 38B will respond. Memory Device 38A will notrespond, as previously described, because signal Lock Out will be activethereby disabling AND gate 90 so that the Address ID Latch 78 will notbe clocked by signal Strobe. The other Memory Devices 38C will not havean active signal Sel In so that the Input Buffers 48, 50 and 52A will bedisabled.

Thus, local address 01H will be loaded into Address ID Latch 78 ofDevice 38B in the same manner as previously described in connection withMemory Device 38A. As can be seen in the FIG. 8A timing diagram, this isaccomplished by placing Tag 08H on the Tag Bus 40 and the next addressto be assigned, address 01H, on the Data Bus 42. This sequence willcontinue until all of the Memory Devices have been assigned a uniquelocal address which is stored in the Address ID Latch 78 associated withthe Memory Device 38 once the last Memory Device, represented by Device38C has been assigned an address, Controller 36 will sense signal SelOut N on line 46D going active thereby ending the assignment sequence.Controller 36 will then end the sequence by causing signal Sel In 0 togo inactive (element 166 of FIG. 13).

Once all of the Memory Devices 38A, 38B and 38C have been assignedaddresses, the memory system is ready to be accessed in a serial selectmethodology. By way of example, if Controller 36 is to read or write toa particular Memory Device 38, a serial select sequence is carried outto enable to particular Memory Device to respond to a series ofinterface commands. It is no longer possible to access the MemoryDevices by way of the Sel In signals due to the active Lock outcondition of all of the Devices.

The manner in which one of the Memory Devices 38 is selected will bedescribed in connection with the FIG. 14 flow chart and the timingdiagram of FIG. 8B. It should be noted that multiple Memory Devices 38can be selected, In that event, the same memory operation will beperformed on each selected Memory Device. It should be further notedthat once a Memory Device has been selected, the Device will remainselected until the Device is deselected or until the Device is reset,either at power on or by a reset Tag command to be described.

In order to select a particular Memory Device 38, Controller 36 willcause the Sel In 0 signal on line 46A to go active as represented byelement 168 of the FIG. 14 flow chart. This signal will propagatethrough all of the Memory Devices 38 of the system since signal Lock Outis active in all of the Devices. As indicated by element 170, Controller36 will enter a wait state in order to permit the signal to propagatethrough the system. An active Sel In signal at each of the MemoryDevices 38 will cause signal Input Enable produced by gate 80 to goactive so that all of the Input Buffers 48, 50 and 52 in all of theMemory Devices 38 will be enabled.

Controller 36 will then, as indicated by element 172 of the FIG. 14 flowchart, place the address of the Memory Device 38 with which theController is to communicate on the Data Bus 42. In addition, Controller36 will place Tag 02H on the Tag Bus 40. As indicated by the last tworows of the table of FIG. 6, Tag 02H performs two functions, one ofwhich is to perform a select function by causing signal Dev Sel (DSEL)to be active and the other of which is to perform a deselect function bycausing signal Dev Sel (DSEL) to become inactive. The particularfunction performed is defined by a modifier bit placed, D7, on the DataBus 42 as shown in the second column of the FIG. 6 table. Since theselect function is to be performed, D7 is set to “1”.

The address of the Memory Device 36 to be selected comprises seven bitsD0-D6. The bits represent the local address of the Memory Device storedin the Address ID Latch 78 (FIG. 5). Thus, if Memory Device 38A is to beselected having address 00H, the value 80H is placed on the Data Bus, asindicated by the FIG. 8B timing diagram together with Tag 02H on the TagBus 40. Controller 36 will also produce a Strobe signal when theappropriate data are present on the Data and Tag buses, as indicated byelement 174.

The address on the Data Bus 38 will be received by all of the MemoryDevices 38 of the system. The address on the Data Bus will then becompared with the local address stored in the Address ID Latch 78 by wayof Comparator 76. Only one of the Memory Devices 38, Device 38A, shouldhave a stored local address 00H which compares with the address on theData Bus. The Comparator 76 of the Memory Device 38A will then generatean active signal Match.

Global Tag Decoder 92 for each of the Memory Devices 38 will detect thepresence of rag 02H on the Tag Bus together with the modifier bit D7 onthe Data Bus. This combination will cause one of the outputs of Decoder92 on line 93 of each Memory Device 38 to go active. The Decoder 92output, together with signals Match, {overscore (SLP)} and signal LockOut, are connected to respective inputs of four input AND gate 100.Signals {overscore (SLP)} and Lockout will typically be active for allof the Devices. However, since signal Match is active only for MemoryDevice 38A, only gate 100 of Device 38A will cause the J input of DeviceSelect flip-flop 74 of Memory Device 38A to be high. The falling edge ofthe Strobe Signal will then cause the Device Select flip-flop 74 ofDevice 38A to be set, thereby causing Device 38A to be selected. Device38A is then in the device-enabled state and will remain in that stateuntil changed by one of the sequences to be subsequently described. Thisstate is depicted in the fifth row of the FIG. 7 table.

The active signal Device Sel will cause signal Decoder Enable at theoutput of gate 82 of selected Device 38A to be active. Thus, the LocalTag Decoder 84 of Device 38A, and only Device 38A, is enabled. Aspreviously noted, Local Tag Decoder 84 functions to decode signals onthe Tag Bus for carrying out memory operation, including Read, Programand Erase operations.

Once signal Dev Sel is active, Controller 36 will cause signal Sel In 0on line 46A to go low or inactive as indicated by element 176 of FIG.14. This step, which is optional, will cause the input buffers for allof the Memory Devices 38 other than Device 38A to be disabled. Thedeselected Memory Devices 38 will thus not respond to data present onthe Data and Tag buses thereby preventing circuitry on the deselecteddevices from toggling in response to the inputs no as to minimize powerconsumption.

As previously noted, it is possible to select more than one MemoryDevice 38 of the system. This is accomplished by repeating theabove-described sequence for each Device to be selected, using theaddress of the target Device in each sequence. Each selected MemoryDevice 38 will then respond to memory commands, such as write commands,erase commands and read commands in the same manner so that multipleoperations will be performed simultaneously on the selected Devices.

The timing diagram of FIG. 8A further illustrates the manner in which aselected Memory Device 38 can be deselected using Tag 02H. FIG. 15 is aflow chart illustrating the sequence for deselecting a Memory Device 38.As indicated by the last row of the table of FIG. 6, Tag 02H withmodifier D7 set to “0” will cause a device to be deselected. Thus,assuming that Device 38A is to be deselected, Tag 02H will be placed onthe Tag Bus and 00H will be placed on the Data Bus.

As indicted by element 178 of the FIG. 15 flow chart, Controller 36first causes signal Sel In 0 to go active in the event it was notalready active. This will propagate to each of the Memory Devices 38,with Controller 36 waiting a predetermined amount of time an indicatedby element 180 of the flow chart. This will cause signal Input Enable(IEN) of the Memory Devices 38 to go active. Note that this step can beskipped since signal Input Enable (IEN) will usually be active on allDevices that are in a selected state by virtue of gate 106. Controller36 will then place Tag 02H on the Tag Bus and 00H on the Data Bus asshown in the FIG. 8A timing diagram and as indicated by element 182 ofthe FIG. 15 flow chart. Comparator 76 of Memory Device 38A will thengenerate signal Match. In addition, Global Tag

Decoder 92 will detect the presence of Tag 02H on the Tag Bus and willalso detect that D7 on the Data Bus is set to a “0” and thereby producean active signal on line 91. Signal Match and line 91 (Tag 02, D7=0),along with signal {overscore (SLP)} are connected to respective inputsof an AND gate 110, the output of which is connected to the K input ofDev Sel flip-flop 74 by way of an OR gate 112. Controller 36 will thenissue a strobe signal thereby clocking flip-flop 74 on the falling edgeso that signal Dev Sel becomes inactive thereby causing Device 38A to bedeselected. Note that signal Lock Out is still active so that, amongother things, the Address ID Latch. 78 containing the assigned addressfor the Memory Device 38A cannot be altered.

As indicated by the third row of the FIG. 6 table, the Memory Devices 38are all set to a reset state by the Power On Reset circuit 70 whichgenerates signal {overscore (L)}ow {overscore (V)}cc. When the Device 38is in the reset state, Lock Out flip-flop 72, Dev Sel flip-flop 74,Sleep flip-flop 71 of all of the Memory Devices 38 are reset by theoutput of NOR gate 86 so that the corresponding signals are inactive. Inaddition, the Address ID Latches 78 are all reset to zeros by signal{overscore (L)}ow {overscore (V)}cc by way of NOR gate 86, inverter 83and NOR gate 99. Assuming that signal Sel In is inactive, Signal InputEnable (IEN) is inactive so that the Input Buffers 48, 50 and 52A are ina low power, disabled state. In addition, the Control Registers are allreset in this mode thereby causing the memory circuitry associated witheach Register to assume a disabled state so as to consume no power, aspreviously noted.

Tag commands can also be used to reset the Memory Devices 38. A GlobalReset command, Tag 01H with modifier bit D0 set to “1” will reset allMemory Devices 38 irrespective of whether the Device is in a selectedstate (Dev Sel active). This command is depicted in the first row of theFIG. 6 table. When the Global Reset command is detected by the GlobalTag Decoder 92 of a Memory Device, the signal on line 87 out of Decoder92 becomes active. This signal is connected to one input of AND gate103, with the second input being connected to receive signal Strobe(buffered). Thus, then Tag 01H, D0=1 is active and signal Strobe changesstate to active high, the output of OR gate 86 will go low. This willcause flip-flops 71 (Sleep), 72 (Lock Out) and 74 (Dev Sel) to be resetby gate 86 and will cause the Address ID Latch 78 to be reset by way ofinverter 83 and NOR gate 99, In addition, the output on line 87 of theGlobal Tag Decoder 92 is connected to one input of a NOR gate 102, withthe output of gate 102 being connected to one input of an AND gate 101.The second input of gate 101 receives signal Strobe (buffered), with theoutput of gate 101 being connected to a second input of NOR gate 99.Thus, when line. 87 at the output of Global Tag Decoder 92 becomesactive when Tag 01, D0=1, and signal Strobe changes state to activehigh, the Address ID Latch 78 is cleared by the output of NOR gate 99.

It is also possible to reset only those Memory Devices 38 that are in aselected state (Dev Sel active). Row 2 of the FIG. 6 depicts a LocalReset Command which resets only those Memory Devices where Dev Sel isactive. As can be seen in FIG. 5, the Global Tag Decoder 92 receivessignal Dev Sel from flip-flop 74. When Controller 36 places Tag 0FH onthe Tag Bus and 01H on the Data Bus (D0=1), the Global Tag Decoder 92output on line 95 will go active for those Memory Devices where Dev Selis active. The K input of Dev Sel flip-flop 74 will go high when the TagDecoder output on line 95 is active by virtue of the connection of line95 to an input of an OR gate 102 and the connection between the outputof OR gate 102 to an input of OR gate 112. Thus, when signal Strobe(buffered) changes state to active high, Dev Sel flip-flop 74 will bereset so that signal Dev Sel goes inactive.

Continuing, the active signal on line 95 of the Global Tag Decoder 92 isactive, the K input of the Sleep flip-flop 71 will be high since theoutput of OR gate 102 is connected to one input of OR gate 104. Thus,when signal Strobe (buffered) changes state to active high, Sleepflip-flop 71 will be reset so that signal Sleep (SLP) goes inactive.

Finally, the OR gate 102 is connected to the K input of Lock Outflip-flop 72. Flip-flop 71 will therefore be reset when signal Strobe(buffered) changes state thereby making signal Lock Out (LOUT) goinactive. The output of OR gate 102 is also connected to one input ofAND gate 101, with the second input of gate 101 receiving signal Strobe(buffered). The output of gate 101 is connected to the reset input ofAddress ID-Latch 78 so that Latch 78 will be cleared of any localaddress.

As previously noted, it is possible to command one or more of the MemoryDevices 38 to a Sleep mode which is similar to the reset mode exceptthat the Address ID Latch 78 is not cleared. As shown in row five of theFIG. 6 table, Tag 01H, D=1, functions to set all Memory Devices 38 whichhave previously been assigned an address which is stored in Address IDLatch 78 into the Sleep mode. As shown in row six of the table, Tag 0FH,D=1, Dev Sel, is used to place Memory Devices 38 which are in theselected state (Dev Sel b“1”) in the Sleep mode. When the ControlRegisters are reset when in the Sleep mode and other reset nodes, theregister contents are all zeros. The CMOS memory control circuitscontrolled by these registers are implemented so that they will entereda disabled state under these conditions so that they will consumeessentially no power

Assuming that Tag 01H, D1=1, are placed on the Tag and Data buses,respectively, the Global Tag Decoder 92 output on line 107 will goactive. Line 107 is connected to one input of OR gate 105 so that theSleep flip-flop 71 will be wet when signal Strobe (buffered) changesstate to active high. Among other things, when in the Sleep state({overscore (SLP)} is a “0”), AND gate 106 is disabled to that signalInput Enable can be made active only by way of the Sel In signal.Further, signal {overscore (SLP)} will disable AND gates 100 and 110 sothat an active signal Match cannot be used to change the state of theDev Sel flip-flop 74.

When Controller 36 issues Tag 0FH, D1=1, the Global Tag Decoder 92output on line 109 becomes active for every Memory Device 38 which isselected (Dev Sel active). Line 109 is connected to one of the inputs ofNOR gate 105 so that the K input of the Sleep flip-flop 71 will be high.Thus, when signal Strobe (buffered) changes state to active high, signalSleep (SLP) will become active and the Memory Device will enter theSleep mode.

As can be seen from the table of FIG. 6, Sleep flip-flop 71 can be resetin various ways, including by way of Tag 01H, D0=1 which causes theflip-flop to be reset through the clear input and Tag 01H, D2=1; Tag0FH, D0=1; Tag 01H, D0=1 and Tag 0FH, D2=1, any of which will cause theoutput of OR gate 104, the output of which is connected to the K inputof flip-flop 71, to be active when signal Strobe (buffered) changesstate to active high. This will cause signal Sleep to become inactive sothat the Memory Device is no longer in the Sleep mode.

The FIG. 3A memory system is organized in a serial select configuration.As previously described, FIG. 3B is a block diagram of a memory systemarranged in a combination serial and radial select configuration. Threebanks of Memory Devices 38 are shown, with each bank having N number ofDevices. Although not shown in FIG. 3B, each Memory Device 38 of thesystem is connected to common Tag Bus 40 and Data Bus 42 and Strobe line44. Controller 36A is configured to provide a separate signal Sel In toeach of the banks of Memory Devices 38. The number of banks of MemoryDevices 38 can be increased by configuring Controller 36A to produceadditional independently controlled signal Sel In.

The sequence for assigning addresses to the Memory Devices 38 for thememory system of FIG. 3B is similar to the sequence described inconnection with FIG. 3A. Controller 36A carries out the assignmentsequence one bank at a time, starting for example, with the first bankconnected to line 46A carrying signal Sel In 0. The signals Sel Inconnected to the remaining two banks are left inactive when addressesare assigned to the first bank. Once the first bank addresses areassigned, signal Sel In 0 is made inactive and signal Sel In 0A is madeactive so that the second bank addressee can be assigned. This processis continued until all of the banks have been assigned addresses.Additional banks of Memory Devices 38 can be accommodated by configuringController 36A to provide additional signals Sel In.

As previously noted, Memory Device 38 is placed in the device-enabledstate, the Controller 36 has the ability to perform various memoryfunctions on the Memory Device 38, including memory read and memoryprogram operations. The device-enabled state is entered whenever bothsignals Input Enable, produced by gate 80 (FIG. 5), and Decoder Enable,produced by gate 82, are active. The Command Decoder Logic block 62(FIG. 4), which includes the Logic Tag Decoder 84 (FIG. 5) functionsprimarily to decode certain commands that are placed on the Tag Bus 40by the Controller 36. As will become further apparent, the subjectsystem provides a very high degree of flexibility so that a wide varietyof memory operations can be controlled by Controller 36 so as to, amongother things, accommodate different types or versions of Memory Devices38. This is accomplished, in part, by utilizing Controller 36 to controlthe various detailed steps necessary to carry such memory operations asprogramming, reading and erasing. The exemplary system will bedescribed, as previously noted, as a system which emulates the operationof a conventional hard disk drive, with the PCMCIA signals provided toController 36 (FIG. 3A).

FIG. 9 is a simplified diagram of the organization of an exemplary flashmemory array for use on a single one of the Memory Devices 38. The totalcapacity of the array is 40 Megabits. The array has a total of ten MainBlocks, each having a capacity of four Megabits, which are addressedusing addresses A₂₂-A₁₉. Each four Megabit Main Block is made up ofeight 512 k bit Erase Blocks which are addressed using addressesA₁₈-A₁₆. The Erase Blocks have separate common source line which permitthe Erase Blocks to be separately erased. Continuing, each Erase Blockconsists of 128 Sectors, with each Sector storing 4352 bits. The Sectorsare addressed using addresses A₁₅-A₉. Finally, each Sector consists of17 Packets, with the Packets being addressed by A₈-A₅, A_(x). AddressA_(x) is used to decode the 17th packet, is with the 17th packettypically containing certain overhead bits such as error correctioncodes and the like.

FIG. 10 is a more detailed diagram of the Command Decoder Logic block 62and the Register block 64 of FIG. 4 The various signals originating fromthe Command Decoder Logic block 62 that are provided to the variousregisters than make up the Register block 66 are briefly described inthe following Table 1.

TABLE 1 Byte Address Increments the Byte Address Increment (BAI)Register (FIG. 12E). Byte Address Loads the Byte Address Register Load(BAL) (FIG. 12E) with the byte address present on the Data Bus [D0-D4]Block Address Loads the Block Address Register Load (BLAL) (FIG. 12B)with the block address present on the Data Bus [D0-D6] Packet AddressIncremente the Packet Address Increment (PAI) Register (FIG. 12D).Packet Address Loads the Packet Address Register Load (PAL) (FIG. 12D)with the packet address present on the Data Bus [D0-D4] Sector AddressLoad the Sector Address Register Load (SAL) (FIG. 12C) with the sectoraddress present on the Data Bus [D0-D7] Select Control Selects a ControlRegister based Register (SCR) upon data on the Data Bus [D0-D4] ReadControl Causes the contents of a selected Register (RCR) ControlRegister to be outputted to the Register Data Bus 59 (FIG. 4) ClearControl Clears all Control Registers. Registers (CCR) Write ControlLoads data from the Data Bus [D0- Regieters (WCR) D7] to the selectedControl Register by way of bus 58 (FIG. 4). Read Data Transfers contentsof the Register (RDR) selected Data Register to the Register Data Bus 55(FIG. 4). Write Data Transfers contents of the Data Register (WDR) Bus58 (FIG. 4) onto the selected Data Register for programming using theByte Address Load Sense Amp Load Sense Amplifier Data into Data (LSAD)Sense Amp latch 132 (FIG. 17). Out/In (O/I) Controls direction of I/OData Buffers 52 when signal Input Enable (IEN) is active. When O/I ie a“1”, the Data Bus 42 is driven and when “0” the Data Bus inputs data.Low Power Indicates the low power state and (LPWR) is active when in theSleep Mode (Sleep = “1”) and when the Lock Out not active (L OUT = “0”)provided Sel In inactive.

FIG. 11 is a truth table for the Command Decoder Logic showing variousselected inputs and selected Decoder Logic outputs. The inputs includedata placed on the Tag Bus 40 and on the Data Bus 42, signal Lock Out(latch 72 of FIG. 5), signal Sleep (latch 71 of FIG. 5), signal Dev Sel(latch 74 of FIG. 5) and Decoder Enable (gate 82 of FIG. 5)

The various registers represented by block 64 are used to carry out abroad array of memory operations. The number of such registers useddepends upon the number of memory functions that are to be controlled,as will be explained. In a typical system, there may be up to andexceeding a dozen different registers, with each register being capableof storing eight bits of data in order to maximize the flexibility ofthe system, it is possible to address each of the registers, to write tothe registers and to read back the contents of the registers. Inaddition, there is the capability of clearing the registers eitherlocally or globally, although some registers do not require thiscapability. There are some registers that are read only registers thatcan be used in test modes to read out internal signals.

In order to carry out the four register operations (address, write, readand clear), there are four commands that are placed on the Tag Bus 40.These commands are sometimes referred to herein as Tag Commands. A firstTag Command (0BH) is used to select a register, with the address of theregister being placed on the Data Bus 42. A second Tag Command (0CH),functions to write to a selected register, with the Data Bus 42containing the data to be written into the register. A third Tag Command(1AH) is used to read the contents of a selected register. Finally, afourth Tag Command (0FH), which was previously described in connectionwith the Select Logic circuitry, is used to clear all of the registersthat are clearable when the associated modifier bits D2-D7 are set to001000. As can be seen in the table of FIG. 10, there are several TagCommands in addition to the four commands just described.

Registers.

As previously noted, a memory system in accordance with the presentinvention preferably utilizes an array of registers that are used tocontrol memory functions. As will be explained, memory operations suchas read operations are carried out by performing one or more individualsub-operations. It is desirable to maximize the number of memoryfunctions that can be controlled by Controller 36 sodas to provide asmuch flexibility as possible.

An exemplary Control Register 270 and some of the associated circuitry,including a Register Decoder 272, is shown in FIG. 21. A typical MemoryDevice 38 may utilize ten or more such registers. Each of the registershas a unique five bit address, R0-R4, which is also sometimes referredto as the name of the register when expressed in Hexadecimal format.

With certain exceptions, the registers must be accessed prior toperforming operations on the registers. This is accomplished by theissuance of a Tag Command 0BH on the Tag Bus along with the address ofthe register on the Data Bus (Table 1). Tag Command 0BH causes theaddress R0-R4 present on the Data Bus to be presented to the RegisterDecoder 272. Only the Decoder 272 having the corresponding address willrespond by becoming enabled.

Once a register has been selected in this manner, data can be loadedinto or out of the registers as will be explained. In addition, certainregisters is may be accessed directly without the use of Tag command0BH, as will be explained.

Referring to the drawings, FIG. 12A is a diagram representing Register00H, sometimes referred to as the ID Code register. Register 00H has anaddress 00H (00000000) which is used to select the register. Register00H, the ID Code Register, contains eight bits which identify the memorytype which can be read out by the user. Register 00H is hard wired andthus cannot be modified.

Register 01H is the Block Address Register (FIG. 12B) which holds theseven most significant bits of the address (A₂₂ to A₂₆) to be used inconnection with a Memory Device 38 during memory read, program and eraseoperations. As previously noted in connection with FIG. 9, the addressesstored in Register 01H are used to address separate ones of the EraseBlocks. The Sector Address Register, Register 02H (FIG. 12C), containsthe intermediate addresses (A₁₅ to A₉) to be used in connection with aMemory Device 38. These addresses identify one of the Sectors of thememory array. Register 03H, the Packet Address Register (FIG. 12D),contains further intermediate addresses (A₈ to A_(s) and A_(x)) whichidentify one of the Packets of the array. Finally, Register 04H, theByte Address Register (FIG. 12E), contains the least significantaddresses (A₄ to A₀) which identify one of the bytes of the array.

Note that the four address registers can be accessed directly, withoutthe use of Tag Command 0BH, by using special dedicated Tag Commands. Ascan be seen by the table of FIG. 11, dedicated Tag Commands 05H, 04H,03H, and 09H can be used to load addresses into the Erase Block Register(01H), the Sector Address Register (02H), the Packet Address Register(03H) and the Byte Address Register (04H), respectively, without thenecessity of first selecting the address registers.

The Packet Address Register (FIG. 12D) is designed so that an addressloaded into the register can be sequentially incremented so that groupof Packets can be sequentially addressed. Controller 36 need onlyprovide an initial address, if the initial address is other than zero.The Packet Address Register includes a Bit 7 that enables and disablesan increment function, with a “1” enabling the function. When theincrement function is enabled, the Packet Address is incremented undercircumstances to be described. The Packet Address Register can also beincremented independent of the state of Bit 7 using Tag Command 07H asshown in the table of FIG. 11. As noted in Table 1, when Tag Command 07Hin decoded by Local Tag Decoder 84, the Command Decoder Logic 62 (FIG.10) will issue signal Packet Address Increment (PAI) which will causethe packet address in the Packet Address Register to increment, providedthe increment function is enabled as indicated by Bit 7 of the PacketAddress Register.

The Byte Address Register (FIG. 12E) is also capable of beingincremented using Tag Command 09H depending upon the state of Bit 7 ofthe Byte Address Register. As can be seen in the table of FIG. 11, thisincrement function is controlled by the state of modifier bit D7 on theData Bus when Tag 09H is issued. When the increment function is enabled,issuance of Tag Command 0DH (FIG. 11) will cause the Command DecodeLogic 62 to generate signal Byte Address Increment (BAI) which willincrement the address in the Byte Address Register.

FIG. 22 is a simplified diagram of the circuitry used for carrying outthe Byte address increment function previously noted. Controller 36 willissue Tag Command 09H used for loading the Byte Address and forcontrolling the increment function. As can be seen from the table ofFIG. 11, Controller 36 will also place bits D4-D0 on the Data Bus 42which represent memory addresses A₄ to A₀ together with bit D7 set tocontrol the byte increment function. Data bits D5-D6 are don't cares.

The FIG. 12E Byte Address Register is implemented in the form of aflip-flop 282 and a five bit ripple counter 280. The output of flip-flop282 is represented by Bit 7 of the Byte Address Counter and the five bitoutput of counter 280 is represented by Bits 1-5 of the Byte Addresscounter 280. As previously noted, the Byte Address Register (flip-flop282 and counter 280) does not need to be selected by Tag Command 0BH inorder to be loaded. As can be seen in the table of FIG. 11, Tag Command09H is used to load a five bit Byte Address into counter 280 and is usedto control the enable function of the Byte Address Counter. The addressbits and enable bit is placed on the Data Bus together with the TagCommand 09H.

Bits D4-D0 from the Data Bus are provided to the inputs of the five bitripple counter 280 (FIG. 22), with the output of counter 280 (ByteAddress Counter) being addresses A₀-A₄ which define a Byte to be readout of the memory. An AND gate 281 is provided which will generate asignal Byte Address Load (BA Load) when Tag 09H is detected along withsignal Strobe. Counter 280 is transparent so that the Byte address D4-D0loaded into the counter will be used to read a single Byte if theincrement function is disabled.

Bit D7 on the Data Bus is set to a “1” in the event the Byte incrementfunction is to be enabled. This bit is connected to the D input offlip-flop 282 which is initially in a reset state so that the Q outputof. The flip-flop will be set when gate 281 generates BA Load. The Qoutput, signal Binc En, is connected to an input of an AND gate 283 withthe other inputs being connected to receive three outputs of Local TagDecoder 84 (FIG. 5) by way of an OR gate 284. Those outputs are Tag 0EH,19H and 0AH. The output of gate 283 is, in turn, connected to one inputof an OR gate 286, with the other input connected to receive a furtheroutput of the Local Tag Decoder, Tag 0DH. Finally, the output of gate286 is connected to an input of an AND gate 288, with the remainingoutput of gate 288 receiving signal Strobe. The output of gate 288generates signal BA Increment (BAI) which is connected to the incrementinput of counter 280 and will cause the counter to increment.

Assuming that signal Binc En is active, counter 280 will increment whenany one of Tags 0EH, 19H and 0AH are received. As can be seen in theTable of FIG. 11, Tag 0E causes signal Load Sense Amp Data (LSAD) to begenerated so that data read out of the memory will be stored in theSense Amplifier latches, as will be described. Once the data is latched,a subsequent Byte can then be read when the Byte Address Counter 280 isincremented. Tag 19H is used to read data and will operate to incrementByte Address Counter 280 when the increment function of the counter isenabled. Finally, Tag 0AH is used to load the data to be programmed, andwill also cause the Byte Address Counter 280 to increment when theincrement function is enabled.

As can be seen from the inputs to OR gate 286, when Tag 0DH is detected,the Byte Address counter 280 will be incremented independent of thestate of the increment enable signal Binc En. The table of FIG. 11 showsTag 0DH is a special tag used exclusively to increment the Byte addresscounter 280.

Signal CLRADD is a reset signal used to reset the various componentsthat make up the Byte Address Register (FIG. 12E) and the Packet AddressRegister (FIG. 12D). Flip-flop 282 is reset by signal CLRADD undervarious conditions as can be seen from FIG. 22. By way of example, whensignal Sleep is produced, flip-flop 282 will be reset by way of OR gate290 and NOR gate 292. Similarly, when signals Lockout (LOUT) and DecoderEnable (DEN) are both active, flip-flop 282 will be reset by way of anNOR gate 294, OR gate 290 and NOR gate 292. In addition, when Tag 0FH isdetected and D4=1 is placed on the Data Bus, flip-flop 282 will be resetby way of AND gate 296 and NOR gate 292.

FIG. 23 shows circuitry which comprises the Packet Address Register(FIG. 12D). The register includes a Packet Address Counter 298 havinginputs connected receive bits D4-D0 from the Data Bus and a flip-flop300. As shown in the table of FIG. 11, Tag 03H is used to load the fivebits of data which correspond to Packet Address (A₅-A₈, A_(x)) intoCounter 298. In addition bit D7 on the Data Bus is used to control theincrement function of Counter 298. Signal Packet Address Load (PA Load),which is used to load Counter 298, is generated by an AND gate 302 whenTag 03H is detected and signal Strobe is generated.

Flip-flop 300 is used to generate a signal Pinc En which is connected tothe increment input of the Packet Address Counter 298. If bit D7 on theData Bus is set to a “1” so that the increment function is to beenabled, flip-flop 300 will be set so that signal Packet AddressIncrement Enable (Pinc En) is active. Signal Pinc En is connected to oneinput of an AND gate 304, with signal A₄ being connected to the otherinput. Signal A₄ is generated by the Byte Address Counter 280 of FIG.22. As will be explained, the Packet Address Counter will be incrementedwhen both signal Pinc En is active and when the Byte Address Counter A₄switches from a “1” to a “0”.

As can also be seen from the table of FIG. 11, Tag 07H can be used tocause the Packet Address Counter 298 to increment independent of signalPinc En. When Tag 07H is detected and signal Strobe is produced, it canbe seen that Counter 298 will be incremented once by way of AND gate 308and OR gate 306. Note also that flip-flop 300 and Counter 298 are resetby signal CLRADD, the same signal used to reset the Byte Address Counter280 (FIG. 22) and associated flip-flop 282.

Additional Control Registers and the functions performed by theRegisters will be described as part of the following description ofbasic memory operations, including memory read, program and eraseoperations. It should be noted that each Memory Device 38 includesvarious sources of voltages used for carrying out these memoryoperations, as can be seen in FIGS. 24A and 24B. In the present example,a High Current Charge Pump circuit 310 (FIG. 24B) is provided that iscapable of generating a positive output voltage in the range of +6volts. A VBL Switch circuit 316 is used to control the magnitude of theCharge Pump Circuit 310 output voltage and to forward the voltage VBL tothe Y Decoder circuitry to be applied to the Bit Lines during memoryoperations. Three trim bits are used to control the magnitude of voltageVBL, with these bits being set by one of the Control Registers to bedescribed. The output of the High Current Charge Pump 310 is alsoconnected to a Source Switch circuit 318 having an output to beconnected to the Source Line of a selected one of the Erase Blocksduring an erase operation. Circuit 318 has three trim bits that are usedto control the magnitude of the Source Line Erase voltage.

A Low Current Charge Pump circuit 314 is also provided (FIG. 24C) whichis capable of generating a positive voltage in the range of +11 volts. AVPX Switch circuit 320 is included having eight trim bits that are usedto adjust the magnitude of the voltage VPX derived from charge pumpcircuit 314 output. As is well known, voltage VPX is forwarded to the XDecoder circuitry and is applied to selected Word Lines depending uponthe memory address during memory operations. A Negative Charge Pumpcircuit 322 generates a negative voltage having a range of approximately−10 volts. Four trim bits are provided for controlling the magnitude ofthe negative voltage VN produced by circuit 322. Negative voltage VN isapplied to the Word Lines by way of the X Decoder circuit during memoryoperations erase operations.

A Word Line Supply circuit 324 is also included for applying the WordLine voltage to the Word Lines by way of the X Decoder circuitry. Unlikethe other circuitry depicted in FIGS. 24A and 24B which is common to theentire Memory Device 38, the Word Line Supply circuitry 324 is repeatedfor each of the eighty Erase Blocks of the Memory Device. When the Eraseinput of the Word Line Supply circuit 324 is active an Erase Block is tobe erased, with such Erase Block associated with the Supply circuitry324 being the selected Erase Block or a deselected Erase Block. If theErase Block is the selected Block, signal Erase Block will be active,otherwise the signal is inactive.

When signals Erase and Erase Block Select are both active, theassociated Erase Block is the selected Block. In that event, Word LineSupply circuit 324 will function to connect negative voltage VPN to theX Decoder circuit for application to all of the Word Lines of theselected Erase Block. When signal Erase is active, but signal EraseBlock is inactive, an Erase Block other than the Block associated withthe Supply circuit 324 is to be erased. In the event, primary supplyvoltage VCC is provided to the X Decoder circuit of the deselectedBlock. VCC is also provided to the Decoder when neither the Erase signalnor the Erase Block select are active. Finally, when Erase Block isactive, but Erase is inactive, an operation other than an eraseoperation is to be carried out on the associated Erase Block. In thatevent, Word Line Supply circuit 324 applies positive voltage VPX to theWord Lines by way of the X Decoder.

Read Operations

As is well known, flash memory cells have threshold voltages which varydepending upon whether the cell is in an erased state or a programmedstate. The threshold voltage is typically defined as the control gate tosource voltage across the cell necessary for the cell to conduct onemicroampere of current for a drain voltage of +1 volt. An erased cellhas a relatively low threshold voltage (V_(THE)), +3 volts for example,and a programmed cell has a relatively high threshold voltage (V_(THP)),+5 volts, for example. In a read operation, the memory system willoperate to ground the source of the cell being read and will apply anappropriate voltage to the control gate by way of the associated WordLine. The drain of the cell, which is connected to the associated BitLine, is typically set to a small positive voltage such as +1 volt. Ifthe cell has been programmed, the current through the cell will berelatively small and if the cell is in an erased state the current willbe relatively high.

In a Read Operation, the cell current is measured using a SenseAmplifier. The same Sense Amplifier is also used in other operationsrelated to Read Operations, such as Erase Verify and Program Verifyoperations. In the present example, a single word is read out consistingof eight bits of data. In order to read an entire word in a singleoperation, a total of eight Sense Amplifiers are provided. FIG. 17 showsa single Sense Amplifier 116 having a pair of differential inputs. Oneinput is connected to a reference voltage which is related to thecurrent flow through a Flash Cell Reference 118. The other input isconnected to a read voltage which is related to the current flow throughthe associated Bit Line 124.

The circuitry associated with Flash Cell Reference 118 is shared by alleight of the Sense Amplifiers. 116. Reference 118 has a controlgate-source voltage which is determined by a Reference Voltage Generator120. Generator 120 produces a voltage which is nominally set to thevoltage applied to the control gate (Word Line) of the cell being read.Thus, the Flash Reference Cell will produce a current which will tend totrack current of the cells in the memory array with variations intemperature, processing and the like. The voltage applied to the FlashReference Cell can be adjusted by way of four digital trim inputs whichprovide over sixteen different voltages depending upon the state of thetrim bits in a manner similar to Digital-To-Analog Converter. TheReference Voltage Generator can thus be used to adjust the margins usedin Read Operations and other similar operations such as Program Verify.

The current flow through the Flash Reference Cell 118 is converted to avoltage by a current to voltage (I/V) converter 122. I/V Converter 122has two trim inputs that can be used to adjust the magnitude of thevoltage applied to the drain of Flash Reference Cell 118. Block 124represents a selected one of the Bit Lines of the memory array. Theparticular Bit Line is selected based upon a portion of the addressprovided to the memory system using decoding circuitry which is notdepicted. In Read Operations, the Bit Line 124 is connected to the SenseAmplifier 116 by way of a pair of pass gates or switches 126 and 128.The switches each include a P and an N channel transistor, with thestate of the switches being controlled by complementary switchingsignals. Switch 126 is controlled by a signal Bypass Program Latches andswitch 128 is controlled by signal Sense Enable.

The current flow through the selected Bit Line 124, the cell current, isconverted to a voltage by I/V Converter 130, with the voltage beingapplied to the non-inverting input of Sense Amplifier 116. I/V Converter130 also functions to apply a voltage to the selected Bit Line 124during the read operation. This voltage, which is applied to the drainsof the cells in the array connected to the selected Bit Line can beadjusted using the same two trim bits used by I/V converter 122. Thus,the voltages applied to the drain of the cell being read and to thedrain of the Flash Reference Cell 118, both typically nominally +1 volt,can be precisely adjusted together.

In a Read Operation, the voltage indicative of the current of the cellbeing read, and which is applied to the inverting input of SenseAmplifier 116, will be less than the reference voltage applied to thenon-inverting input if the cell is in an erased state. This will causethe output of Sense Amplifier 116 to go high thereby indicating that thecell is a logical “1”. If the cell being read has been programmed, theSense Amplifier output will remain low indicating that the cell is alogical “0”. The output of the Sense Amplifier 116 is held in a SenseAmplifier Latch 132 for eventual read out through switch 135 controlledby the Read Data Register (RDR) signal (Table 1). The read data fromswitch 135 are transferred to the Data Bus 42 by way of lines DL[8] (55)of FIG. 4. As noted in Table 1, the Command Decode Logic causes signalLoad Sense Amplifier Data (LSAD) to be generated so that the SenseAmplifier Latch 132 will latch the output of the Sense Amplifier 116.

In program operations, switches 126 and 128 are turned off. In additiona switch 134 is turned on by a signal Sense Block Bypass therebybypassing the Sense Amplifier circuitry. This will enable data presenton the Data Bus to be applied to the input of a Program Latch 136. Ifthe data to be programmed is a logical “0” the target cell in the arrayis to be programmed. In that event, Program Latch 136 will output +6volts to the Bit Line 124, which, together with the voltages applied tothe associated Word and Source Lines, will cause the cell to beprogrammed.

In the event the data is a logical “1”, the cell should not beprogrammed but should be left in the original erase state. Thus, theProgram Latch output will be set to near ground potential.

FIG. 16 is a flow chart depicting an exemplary Read Operation. In thisoperation, a Sector of the memory will be read out. As can be seen fromFIG. 9, each Sector contains 544 Bytes of data. It is assumed theController 36 has already assigned each of the Memory Devices 38 aunique address (effectively A₂₉ to A₂₃) which is stored in each of theassociated Address ID Latches 78 (FIG. 5). The first step of the ReadOperation, as indicated by element 186 of FIG. 16, is the selection ofthe Memory Device 38 to be read. As previously described, this isaccomplished by Controller 36 placing Tag Command 02H of the Tag Bus 40and certain data on Data Bus 42 (FIG. 6). Bit D7 of the data, themodifier bit, is set to “1” so that a Memory Device is selected ratherthan deselected. Bits D6 to D0 are set to correspond to address bits A₂₉to A₂₃ of the target Memory Device. As can be seen from FIG. 6, thiswill cause the single selected one of the Memory Devices 38 to beselected (Dev Sel is Set).

Once a Memory Device 38 is-selected, Tag Command 0FH is issued andplaced on Tag Bug 40 for the purpose of resetting those Registers of theselected Device that are capable of being reset. Data is placed the DataBus at the same time Tag 0FH is issued. The data act as modifier bits todefine the function that Tag 0FH will perform. The data is 08H(00001000), which means that only bit D3 is set to a “1”. As can be seenin FIG. 11 table, when only bit D3 is set, Tag 0FH will function toreset the resettable Registers of the selected Memory Device. This isaccomplished by issuance of signal Clear Control Register (CCR) byCommand Decode Logic 62 (FIG. 10), with signal CCR being connected tothe clear input of the Control Registers (FIG. 21).

In addition, Register Control A (FIG. 12F) is selected and bit 4 is setso as to enable a memory reference voltage generator which is normallydeselected to minimize power consumption. The register is first selectedby placing Tag 0BH on the Tag Bus, with 05H being placed on the Data Busso that the Register Control A (05H) is selected. Next, Bit 4 of theregister is set to a “1” by using Tag Command 0CH which, as indicated bytable of FIG. 11, function to load data present on the Data Bus into theselected register. In this case the data on the Data Bus is 10H so thatonly Bit 4 of Register Control A is set.

Next, as indicated by element 188 of FIG. 16, various memory circuitsused to control memory read operations are set to a proper state byselecting the appropriate ones of the Control Registers using TagCommand 0BH and by loading appropriate data into the registers forcontrolling the state of such circuitry in the same manner that thereference voltage generator was enabled earlier in the read sequence. Byway of example, Control Register B (FIG. 12G) is selected using TagCommand 0BH and placing 06H on the Data Bus. Control Register B (06H)contains eight trim bits that are applied to VPX Switch 320 used tocontrol the magnitude of the voltage VPX applied to the Word Linesduring the memory operation.

Typically, three different Word Line voltage magnitudes are used formemory read, memory program and memory program verify operations. Theapplied voltage is typically in the range of +6 volts. Thus, onceControl Register B has been selected, Tag Command 0CH is used to loadthe eight bits of voltage trim data placed on the Data Bus 40 intoControl Register B.

Continuing, Control Register C (FIG. 12H) is then selected using TagCommand 0BH. This register contains a Bit 7 which is used to enable theLow Current Charge Pump circuit 314 which produces the voltage which,after being trimmed by the VPX Switch circuit 320, is applied to aselected Word Line during a memory programming and read operations.Control Register further contains a Bit 6 which functions to connecthigh voltage program data to a selected Bit Line during a programoperation. Bit 5 of Control Register C enables and disables the VPXSwitch circuit 322 which produces voltage VPX.

In order to carry out a memory read operation, Tag Command 0CH is usedto set Bit 7 to a “1” so as to enable the Low Current Charge Pump 314.Next, Control Register D (FIG. 12I) is selected and Bits 0-3 are set toa selected trim value in order to control the read margin in readoperations. These four bits are used to control the magnitude of theoutput voltage of the Reference Voltage Generator 120 (FIG. 17). Inaddition, Bit 1 of Control Register D is set to a “1” to enable theReference Voltage Generator 120.

Continuing, the address of the first Byte of the first Packet of theSector be read out of the selected Memory Device is provided to theDevice by the Controller 36 as indicated by element 190 of FIG. 16. Thisis accomplished in two steps. First, Tag Command 05H is placed on theTag Bus and the seven address bits A₂₂ to A₁₆ identifying the particularErase Block containing the Sector to be read are placed on the Data Bus.As previously noted, Tag Command 05H functions to automatically selectthe Block Address Register (FIG. 12B) so that the Tag Command 0BH is notneeded. Tag Command 05H will also cause signal BAL to be generated(Table 1) by the Command Decode Logic 62. Signal BAL will cause the.Data present on the Data Bus to be loaded into the Block AddressRegister (FIG. 12B). Note that it would also be possible to access theErase Block Address Register for testing purposes and the like byissuing Tag Command 0BH and placing the address of the register (01H) onthe Data Bus.

Next, Controller 36 will issue a Tag Command 04H for loading the SectorAddress Register (FIG. 12C) with addresses A₁₅ to A₉. The address bitsare placed on the Data Bus at the same time Tag 04H is placed on the TagBus. The Tag Command will cause the Command Decoder Logic 62 to issuesignal Sector Address Load (SAL) which will cause the Sector AddressRegister (FIG. 12C) to be loaded with the address bits on the Data Bus.The contents of the Packet Address Register (FIG. 12D) and the ByteAddress Register (FIG. 12E) will both be initialized by using TagCommands 03H and 09H, respectively. Data 80H will be placed on the DataBus so that the increment feature (Bit 7) will be enabled for bothregister and so that the initial address bits A₈ to A₀ and A_(x) will beset to all zeros at this stage of the sequence.

Next, Register Control E is selected. As can be seen in FIG. 12J, whenBit 4 is a “1”, all of the Word Lines of a selected Erase Block areselected. The selected Erase Block is determined by the address justloaded into the address registers. However, all of the Word Lines of theErase Block will be forced to the same state by Bit 4, independent ofthe loaded address. Bit 3 causes all of the Word Lines of the selectedErase Block to be deselected when Bit 3 is a “0”. Bit 2, when set to a“1”, causes all eight main blocks of the Memory Device to be selected.Bit 1, when set to a “1”, causes all eight Erase Blocks of the selectedMain Block to be selected. Finally, Bit 0, when set to a “0”, causes allof the Main Blocks to be deselected.

In this stage of the Read operation, Register Control E is loaded with09H so that Bit 3 is set to a “1” thereby enabling all of the Word Linesof the selected Erase Block and so that Bit 0 is set to a “1” so thatall Main Blocks are enabled.

Continuing, Controller 36 will then issue a Tag Command 0BH to selectRegister Control F (FIG. 12K). Bit 7 of this register is used to connectand disconnect the DL bus to and from the DZ bus. Referring to FIG. 17,signal Sense Block Bypass is controlled by this bit. When the signal isactive, switch 134 is conductive bypassing the sense amplifier circuitryso that the DL bus is connected directly to the DZ bus in programmingoperations. In addition, Bit 1 of Register Control F is used todischarge the Bit Lines of the selected Erase Block when set to a “0”together with the DZ bus. Bit 0 of the register is used to float all BitLines of the selected Erase Block when set to a “0”. In the presentexample, 03H is loaded into selected Register Control F using TagCommand 0CH so that Bits 0 and 1 are set to a “1” so that the Bit Linesand DZ bus will be discharged and so that the float function performedby Bit 0 is disabled. Once the Bit Lines and DZ bus have discharged, asecond Tag Command 0CH is issued to set Bit 1 to a “0” therebyterminating the discharge function. Note that since Register Control Fwas already selected, it is not necessary to repeat the select operationusing Tag Command 0BH.

Controller 36 will then select Register Control G (FIG. 12L). Bit 6 ofthis register is used to generate signal Bypass Program Latches (FIG.17) which is used to control switch 126 which functions to bypass theprogram latches 136 so that the sense amplifier circuitry is connectedto the Bit Lines 124 so that a read operation can be carried out. Bit 4of the register is used to generate signal Sense Enable which functionsto enable the Sense Amplifier 116 and related circuitry including switch128 which connects the Bit Lines 124 to the input of the Sense Amplifiercircuitry. In the present example, 50H is loaded into Register Control Gthereby causing the Program Latches 136 to be bypassed and the senseamplifier circuitry to be enabled.

Controller 36 will then select Register Control C (FIG. 12H). Bits 7 and5 of this register are then set to a “1”. As previously described, whenBit 7 is a “1”, the Low Current Charge Pump circuit 314 (FIG. 24) isenabled. When Bit 5 is a “1”, the output of the low current charge pumpis connected to the X Decoder circuitry so that charge pump voltage willbe applied to the selected word line.

The actual reading of the array is then commenced as indicated byelement 192 of FIG. 16. As is well known, some of the address bits willbe applied to an X Decoder which will select a predetermined one of theWord Lines of the memory array. As will be explained in greater detailin connection with FIG. 24B, the voltage VPX generated by the lowcurrent charge pump circuit will be applied to the selected Word Line.It is possible to use a low current pump since the Word Lines drawlittle current during read operations. The remaining address bits willbe applied to a Y Decoder which will select the eight Bit Linesassociated with the eight bits that make up the word to be read. Aspreviously noted, the Bit Line voltage for carrying out read operationsis applied by the I/V Converter circuit 130 of FIG. 17. The Source Lineof the selected Erase Block is also grounded during the read operation.

At this point in the Read Operation, there is a timeout of a fewmicroseconds as indicated by element 194 of the FIG. 16 flow chart sothat the various charge pumps and Word Lines have an opportunity tocharge up. The appropriate voltages have been applied to the Word Lines,Bit Lines and the Source Line associated with the eight cells to beread.

The Sense Amplifiers 116 will then sense the presence or absence ofcurrent for those eight cells that make up the first Byte of the Sectorbeing read. Controller 36 will issue Tag Command 19H (FIG. 11) with theassociated signal Strobe. The timing diagram of FIG. 25 illustrates thisaspect of the read operation. Once Tag Command 19H is detected, signalOut/In becomes active so that I/O Buffer 52 (FIG. 4) will be capable oftransferring the data being read out of the memory array from DL Bus 55to the external Data Bus 42. At this time, data held in the SenseAmplifier Latch 132 (FIG. 17) will be placed on the Data Bus 42.

Signal Strobe together with Tag 19H will also cause signal Load SenseAmplifier Data (LSAD) to go active. As previously described, this signalwill cause the read data present on the output of the eight SenseAmplifiers 116 (FIG. 17) to be loaded into the associated SenseAmplifier Latch 132. Latch 132 is transparent so that the SenseAmplifier 116 outputs will be present on the external Data Bus 42 atthis time. Signal Strobe will then go inactive thereby causing LSAD togo inactive thereby latching the read data. At this point, the readingof the next Byte can commence since any changes in the output of theSense Amplifiers will not affect the state of the Sense AmplifierLatches 132.

Controller 36 will then issue a second Tag Command 19H and associatedStrobe. This will cause signal BA Increment (FIG. 22) to be generatedthereby causing Byte Counter 280 (A₄ to A₀) to increment from all zerosto 00001. A determination is then made, as indicated by element 198 ofthe FIG. 16 flow chart, whether all of Bytes of data have been read outof the first Packet. There are 32 Bytes of data in each Packet, so ifthe count is less than 31, the sequence will return to element 196 andthe second Byte of data is read out of address 0001.

This sequence will be repeated until thirty-two Bytes have been readthereby indicating that the first Packet of the Sector has been read. Atthis point, address A₄ of the Byte Address Counter will switch from a“1” to a “0” so that the Packet Address Counter 298 (FIG. 23) willincremented by way of gates 304 and 306. As indicated by element 200, adetermination is then made as to whether the final Packet of the Sectorhas been read. There are seventeen Packets of data per Sector so if thecount is less than sixteen, the sequence will return to element 196 andthe first Byte of the second Packet will proceed to be read out. Thissequence will continue until all seventeen Packets of data, 512 Bytes,have been read out. The seventeen Packets of data comprise a Sectorwhich represents an entire row of the memory array.

Once the Sector has been read out, the various circuits used in thememory read operation, including charge pumps, are preferably disabledas indicated by element 202 of the FIG. 16 flow chart. This isaccomplished by setting appropriate bits in appropriate ControlRegisters using various Tag Commands. First, Register Control C (FIG.12H) is selected using Tag Command 0BH and placing 07H on the Data Bus.Once the register is selected, 80H is written into the register usingTag Command 0CH. This will cause Bit 5 to change from a “1” to a “0”thereby disabling the VPX circuit 320 which applies the output voltageVPX derived from the Low Current Charge Pump 314 to the Word Lines.Next, while Register Control C remains selected, Bit 7 is set to a “0”thereby disabling the Low Current Charge Pump circuit 314. A short delayis introduced at this point to allow the charge pump circuit 314 and theWord Line to discharge. Register Control G (FIG. 12L) is then selectedand Bits 4 and 6 are set to “0” thereby disabling the sense amplifiercircuitry and turning off switch 126 which bypasses the Program Latch136. Next, Register Control D (FIG. 12I) is selected and all Bits areset to “0” thereby disabling the reference generator and the sensetrims. Register Control F is then selected and Bit 0 is set to “1”thereby disabling the Bit Line float function. In addition, Bit 1 is setto a “1” so that the Bit Line discharge function is enabled so as todischarge the Bit Lines and the DZ Bus. Finally, Bit 1 of RegisterControl F is set back to a “0” thereby terminating the dischargefunction. That completes the sector read operation.

Program Operations

FIGS. 18A and 18B are flow charts illustrating an exemplary SectorProgram Operation of the FIG. 3A memory system. FIG. 19 shows additionaldetails regarding the Program Latch 136 of FIG. 17 used in programmingoperations. Prior to describing the Sector Program Operation, ProgramLatch 136 will be described. Latch 136 includes a pair of inverters 138and 140 connected together with a switch 142 to form a loop. When switch142 is conductive, inverter are connected to provide positive feedbackso that the signal applied to the input of inverter 138 will be latched.Switch 142 is controlled by a signal DLOAD and the inverse of thatsignal.

Inverter 138 and 140 are both powered by voltage VBL so that the outputof the Program Latch 136, the output of inverter 138, will be at thatvoltage when the Latch input is a “0”. As previously described, voltageVBL is generated on the Memory Device 38 by a High Current Charge Pumpcircuit 310 which has a nominal output +6 volts, with the magnitudebeing adjustable by way of three trim inputs to VBL Switch circuit 316.The output of Latch 136 is connected to the selected Bit Line 124 by wayof a pass transistor 144 which can be turned on and off by a signal PGMhaving a magnitude of +11 volts when active. As will be explained ingreater detail, a cell will be programmed when the associated Bit Lineis set to VBL (+6 volts), the associated Word Line is set to +11 voltsand Source Line is grounded.

An exemplary Sector Program Operation will now be described inconnection with FIGS. 18A and 18B. Again, it is assumed that all of theMemory Devices 38 of the memory system have been assigned addresses byController 36 so that the Address ID Latch 78 (FIG. 5) of all of theMemory Devices will be set with the address of each associated Device.As indicated by element 204 of FIG. 18A, the Memory Device 38 which isto be programmed is first selected by Controller 36 placing Tag Command02H on the Tag Bus and certain data on Data Bus 42 (FIG. 6). Bit D7 ofthe data, the modifier bit, isset to “1” so that a Memory Device isselected rather than deselected. Bits D6 to D0 are set to correspond toaddress bits A₂₉ to A₂₃ of the target Memory Device. As can be seen fromFIG. 6, this will cause the single selected one of the Memory Devices 38to be selected (Dev Sel is Set). Once a Memory Device 38 is selected,Tag Command 0FH is issued and placed on Tag Bus 40 for the purpose ofresetting those Registers of the selected Device that are capable ofbeing reset. Data is placed the Data Bus at the same time Tag 0FH isissued. The data act as modifier bits to define the function that Tag0FH will perform. The data is 08H (00001000), which means that only bitD3 is set to a “1”. As can be seen in FIG. 11, when only bit D3 is set,Tag 0FH will function to reset the resettable Registers of the selectedMemory Device. This is accomplished by issuance of signal Clear ControlRegister (CCR) by Command Decode Logic 62 (FIG. 10).

In addition, the Reference Voltage Generator is enabled, as previouslydescribed in the Read Sector sequence by selecting Register 05H (FIG.12F) and setting Bit 4 to a “1”.

The address of the Sector to be programmed is then provided to theselected Memory Device 38 as indicated by element 206 of FIG. 8A. First,Tag Command 05H is placed on the Tag Bus and the seven address bits A₂₂to A₁₆ identifying the particular Erase Block containing the Sector tobe programmed are placed on the Data Bus. As previously noted, TagCommand 05H functions to automatically select the Block Address Register(FIG. 12B) so that the Tag Command 02H is not needed. Tag Command 05Hwill also cause signal BAL to be generated (Table 1) by the CommandDecode Logic 62. Signal BAL will cause the data present on the Data Busto be loaded into the Block Address Register (FIG. 12B). Next,Controller 36 will issue a Tag Command 04H for loading the SectorAddress Register (FIG. 12C) with addresses A₁₅ to A₉. The address bitsare placed on the Data Bus at the same time Tag 04H is placed on the TagBus. The Tag Command will cause the Command Decoder Logic 62 to issuesignal Sector Address Load (SAL) which will cause the Sector AddressRegister (FIG. 12C) to be loaded with the address bits on the Data Bus.The contents of the Packet Address Register (FIG. 12D) and the ByteAddress Register (FIG. 12E) will both be initialized by using TagCommands 03H and 09H, respectively. Data 80H will be placed on the DataBus so that the increment feature (Bit 7) will be enabled for the ByteAddress Register (FIG. 12E) and so that the initial address bits A₈ toA₀, A_(x) will be set to all zeros at this stage of the sequence.

Controller 36 will also cause appropriate ones of the circuitry used forprogramming to set to the desired state. This is accomplished by issuinga sequence of Tag Commands so that the pertinent bits of various ones ofthe Control Registers are set to a desired state. First, Tag Command 0BHis issued and 06H is placed on the Data Bus to select Register Control B(FIG. 12G). Next, the Word Line trim voltage is set by loading theappropriate eight bits into Register Control B. These trim bits areapplied to the VPX Switch circuit 320 (FIG. 24B) so that the Word Linevoltage is at the exact desired level. In addition, the Low CurrentCharge Pump 314 is enabled by setting Bit 7 of Register Control C (FIG.12H).

Continuing, Register Control 0BH is (FIG. 12M) is selected, with thisregister containing Bits 3-5 that are used to control the magnitude ofvoltage VBL, the voltage applied to the Bit Lines by the Y Decodercircuit during programming. As can be seen in FIG. 24B, the three trimbits are applied to the VBL Switch circuit 316. In addition, the HighCurrent Charge Pump circuit 310 is enabled along with enabling the VBLSwitch circuit 316 by setting Bits 1 and 2 to a “6”.

Next, Register Control F (FIG. 12K) is selected and Bit 2 0 and 1 areset to a “1” thereby disabling the Bit Line float function and causingthe Bit Lines and DZ Bus to switch to a discharged state. Bit 1 of theregister is then set to a “0” to terminate the discharge function.Register Control F (FIG. 12K) is then selected and Bit 7 is set to a“1”n thereby causing signal Sense Block Bypass (FIG. 17) to go activethereby turning on switch 134 and bypassing the sense amplifiercircuitry.

The data to be programmed into the Sector is then loaded into theselected Memory Device 38, as indicated by element 208 of FIG. 18A. Theprogram data are loaded into thirty-two 8 bit Program Data Registers 400one byte at a time. FIG. 26 shows the Program Data Registers 400, witheach one bit stage of the Register corresponding to the Program DataLatch 136 of FIG. 19. The Program Data Registers are selected by aProgram Register Decoder circuit 402 that receives the five bits of ByteAddress A₀-A₄ generated by the Byte Address Counter 280 (FIG. 22).

The data for programming a single Packet, 32 Bytes is loaded one Byte ata time. Tag Command 0AH (FIG. 11) is placed on the Tag Bus 40 and theeight bits of the first Byte of data are placed on the Data Bus 42.Among other things, Tag Command 0AH will cause signal Write DataRegister (WDR) to be produced thereby causing Decoder 402 to producesignal DLOADA which is forwarded to Program Register 0 based uponinitial address A₀-A₄ of 0000. This will cause the first Byte of programdata to be loaded into a Program Register 0. Next, the second Byte ofprogram data is placed on the Data Bus 42 together with Tag Command 0AH.Tag 0AH will cause the Byte Address Counter 280 to increment so that theProgram Register Decoder 402 will select Program Data Register 1 toreceive the byte of program data. This sequence is repeated untilthirty-two Bytes of programming data are loaded into the thirty-twoProgram Data Registers.

As indicated by element 210, the programming voltages are then appliedto the selected Word Lines and Bit Lines so that the first Byte of datais programmed into the array. Register Control C (FIG. 12H) is firstselected and Bit 5 is set to a “1” so as to enable VPX Switch circuit320 (FIG. 24B). This will cause voltage VPX to be applied to theselected Word Line associated with the cells to be programmed. RegisterControl I (FIG. 12N) is then selected and Bit 2 is set so that VBLSwitch circuit 316 will function to connect the High Current Pump 310output to line VBL. In addition, Bit 6 is set to a “1” so as to connectthe output of the VBL Switch circuit 316 to the Program Latches 136(FIG. 19) so that the voltage will be applied to the Bit Lines 124 forthose Bit Lines associated with a cell to be programmed.

As indicated by element 220, the sequence enters a short wait statewhile the programming voltages are applied to the memory array. At thispoint, 32 Bytes of data are programmed at the same time.

The Controller then places appropriate Tag Commands on the Data Bus andplaces appropriate data on the data bus to turn off the programmingvoltages applied to the Word Lines and Bit Lines (element 222 of FIG.18A). Register Control H (FIG. 12M) is selected and Bit 2 is set to a“0” thereby disabling VPX Switch circuit 320. There is a short wait atthis point to permit the Bit Lines to become discharged. RegisterControl C (FIG. 12H) is then selected and Bit 6 is set to a “0” therebydisabling VBL Switch circuit 316 so that voltage VBL is no longerapplied to the program latches 136. Next, Bit 5 of the register is setto a “0” thereby disconnecting voltage VPX from the Word Lines.

In addition, as indicated by element 224 of the FIG. 18A flow chart,Controller 36 causes the Bit Lines to be discharged. This isaccomplished by selecting Register Control F (FIG. 12K) and setting Bits0 and 1 to a “1”. This disables the float function (Bit 0) and enablesthe discharge function. Once the discharge is completed, Bit 1 is setback to a “0” loading appropriate data into one of the Control Registersas indicated by element 224 of FIG. 18A.

A determination is then made as to whether the last Packet of data forthe Sector has been programmed (element 226 of FIG. 18A). Since only thefirst Packet has been programmed, the Packet Address Counter (FIG. 23)will be incremented (element 228) by issuance of Tag Command 07H. TagCommand 07H together with signal Strobe will cause AND gate 308 to beenabled thereby incrementing the counter by way of OR gate 306. Once thePacket address has been incremented, the sequence will return to element208 of the FIG. 18A flow chart. The next Packet of data will-beprogrammed, with the process being repeated until the last Packet of theSector has been programmed.

Once the Sector has been programmed, it is necessary to enter averification sequence to confirm proper programming. As indicated byelement 230, the first step of the verification is to set the variouscircuits that perform the verify function to an enabled state. Theverification sequence is similar to the previously-described readoperation, with the voltage applied to the Word Line and the voltagemargins used by the Sense Amplifier circuitry being set so that anymarginally programmed cells will be detected. Preferably, a Byte of datais read out and loaded into a data buffer followed by 31 further readoperations until one Packet or 32 Bytes of data are read, as indicatedby element 232 of FIG. 8B.

The 32 Bytes of data are transferred to Controller 36 one Byte at a timeso that the data read can be compared with the data programmed. Thisprocess is repeated until all Packets of the Sector are verified, asindicated by element 234. Once the verification is completed, circuitryused for programming and verification is turned off and the Word Linesare discharge by grounding (element 236). That completes the SectorProgram operation.

Erase Operation

As previously explained, Erase Operations are performed on all cellslocated in a particular Erase Block. FIGS. 20A and 20B are a flow chartillustrating an exemplary Erase Operation for the FIG. 3A memory system.In the exemplary memory system, cells are erased using a negative gateerase sequence as described more fully in patent application Ser. No.08/606,215 and filed on Feb. 23, 1996 and entitled SEGMENTEDNON-VOLATILE MEMORY ARRAY WITH MULTIPLE SOURCES HAVING IMPROVED SOURCELINE DECODE CIRCUITRY. The contents of such application are hereby fullyincorporated into the present application by reference. Erasure isaccomplished by setting all of the Word Lines of the selected EraseBlock to a large negative voltage, such as −10 volts. The Bit Lines areall left floating (set to a high impedance) and the Source Line of theselected Erase Block is set to a positive voltage, such as +5 volts.This set of conditions will cause any excess electrons present on thefloating gate of the cells to be removed thereby causing the cells tobecome erased. AB is conventional, the voltages are applied for a fixedduration, similar to a voltage pulse. The duration is set so thatseveral of such erase pulses need to be applied in order to complete theErase Operation. After each erase pulse has been applied, Controller 36will perform an Erase Verification sequence to determine whether all ofthe cells have been adequately erased. The Erase Verification is a typeof read operation which functions to confirm that the threshold voltagesof all of the cells have been reduced to the desired level.

Referring to FIG. 20A, the first step of the erase sequence is carriedout by Controller 36 first selecting the Memory Device 38 containing theErase Block to be erased in the manner previously described inconnection with the Read and Program operations. Once the Device 38 hasbeen selected, Controller 36 loads the address A₂₂ to A₁₆ of the MainBlock which contains the Erase Block to be erased into the Block AddressRegister (FIG. 12B) (element 238). This is accomplished when Tag Command05H (FIG. 11) is issued on the Tag Bus 40 and address A₂₂ to A₁₆ areplaced on the Data Bus 42. In addition, Controller 36 causes the BitLines of the array to float and causes the Word Lines of the Eras eBlock to be disabled by setting the appropriate bits in the appropriateControl Registers to the desired state. First, Register Control F (FIG.12K) is selected and Bit 0 is set to a “0” thereby enabling the Bit Linefloat function. Next, Register Control E (FIG. 12J) is selected and allbits are set to a “0”0 except for Bit 0 which is set to a “1”. Since Bit3 is a “0”, all of the Word Line decoders of the selected Erase Blockwill be disabled.

As indicated by element 240, the various circuits used for carrying outthe erase operation are enabled by Controller 36 setting the appropriatebits in the Control Registers which control such circuitry. RegisterControl B (FIG. 12G) is selected and the appropriate Word Line voltagetrim bit values are loaded into the register. Note that the Word Linevoltage will be negative, with Bits 0-2 of the register functioning tocontrol the magnitude of the negative voltage applied to Word Line ofthe selected Erase Block by the Word Line Supple Circuit 324. RegisterControl H (FIG. 12H) is then selected and Bit 1 is set to a “1” therebyenabling the High Current Charge Pump circuit 310.

Continuing, Register Control I (FIG. 12N) is selected and Bit 6 is setto a “1” so as to enable the Negative Charge Pump circuit 322 (FIG.24A). In addition, Bits 2-5 of Register Control I are set, with thesebits being trim bits coupled to the Source Switch circuit 318 (FIG. 24B)and used to control the magnitude of the positive voltage applied to theSource Line of the Erase Block being erased. The Source Switch circuit318 is enabled by setting Bit 2 to a “1”.

Bit 1 of Register Control I (FIG. 12N) is used to control signal Eraseconnected to the Word Line Supply circuit 324 of FIG. 24A. When Bit 1 isa “1”, the signal is enabled so that the negative output voltage VPNprovided by Negative Pump circuit 322 is connected to the Word Lines ofthe selected Erase Block by way of the X Decoder circuits. The Word LineSupply circuit 324 functions to connect primary supply voltage VCC tothe deselected Blocks. As previously described, when Bit 1 is a “0”,thereby indicating that an operation other than an Erase operation is tobe carried out. The Word Line Supply circuit 324 applies the positivevoltage VPX produced by the Low Current Pump circuit 314 to the WordLines of the selected Erase Block and voltage Vcc to the deselectedBlock. In present case, Bit 1 is set to a “1” so that negative voltageVPN will be applied to the Word Lines of the selected Erase Block.

Register Control C (FIG. 12H) is then selected and Bits 5 and 7 are setto a “1” to enable Low Current Pump circuit 314 and to enable the VPXSwitch circuit 320. These conditions cause the actual erase operation tocommence. As represented by element 244 of the FIG. 19A flow chart, theController will then wait a predetermined amount of time while the erasevoltages are applied. During this wait period, a single erase pulse iseffectively applied to the selected Erase Block.

The duration of the wait period is such that a single erase pulse isinsufficient to adequately erase the Erase Block. However, afterapplication of each erase pulse, an erase verify sequence is carried outto determine whether the Block has been properly erased. The eraseverify sequence functions to read the cells of the Erase Block toconfirm that all of the cells have been erased and are in a logic “1”state. As indicated by element 246, the high voltages applied to theSource and Word Lines of the Erase Block are removed. This isaccomplished by selecting Register Control H and setting Bit 1 to a “0”thereby turning off the High Current Charge Pump circuit 310. Next, theSource Line is grounded and the Word Lines are left floating asindicated by element 248.

The circuitry which provides the voltage used in the erase verifysequence is then enabled as shown by element 250 of FIG. 20B. As is wellknown, the voltages are similar to those used in normal read operations,but are set to values that tend to detect cells that have only beenmarginally erased. By way of example, Register Control B (FIG. 12G) isselected and the Word Line Trim bits contained in that register are setsuch that the Word Line voltage used in Erase Verify is about 1 voltless than the value used in a normal read operation.

As shown by element 252, the Erase Block is verified by reading oneSector at a time. If the verify sequence indicates that any cells in thefirst Sector are still in a programmed state (“0” state), element 254indicates that it will be necessary to apply a further erase pulse toall sectors in the Erase Block. Thus, the read circuitry is disabled anddisconnected and the erase circuitry is enabled as indicated by element256. A determination is then made as to whether the number of erasepulses applied exceeds a predetermined maximum number (element 258). Ifthat is the case, it is assumed that the Erase Block cannot be properlyerased and the erase sequence will be terminated. Typically, Controller36 will store an indication that the Erase Block in question isdefective and will refrain from further use of such Block. Controller 36will then disable the high voltage circuitry and other circuitry used inthe erase operation as indicated by element 262 thereby concluding theerase operation.

In fact, since only a single erase pulse will have been applied to theErase Block, the sequence will return to element 238 of FIG. 20A and asecond erase pulse will be applied to the Erase Block. This sequencewill be repeated until the first Sector of the Erase Block passes theerase verify (element 254). If the first Sector passes, a determinationis made as to whether all of the Sectors of the Erase Block have beenverified to have been properly erased (element 264). Since only thefirst Sector has been verified to have been properly erased, the Sectoraddress in the Sector Address Register (FIG. 12C) is then incremented(element 266) by loading a new address into the register and a secondSector is erased and verified. This will continue until all 128 Sectorsof the Erase Block have been erased and verified. As indicated byelement 268 of FIG. 20B, the Erase sequence is concluded when the highvoltage and other circuits used in the sequence are turned off.

Thus, a memory system has been disclosed having a flexible busarchitecture which permits a wide variety of individual memory devicesto be accommodated. By way of example, in the event the address lengthfor the memory devices is changed, it is possible to accommodate suchchanges by changing the number of address commands transmitted duringmemory read and program operations from the four commands previouslydescribed (block address 05H, sector address 04H, packet address 03H andbyte address 09H) to less than four or more than four. Although apreferred embodiment has been described in some detail, it is to beunderstood that certain changes can be made without departing from thespirit and scope of the invention as defined by the appended claims.

What is claimed is:
 1. A memory device comprising: a system businterface to be coupled to a system bus which includes a tag bus and adata bus, with the system bus interface including a tag bus interfaceand a bi-directional data bus interface; an array of memory cells; amemory operation manager operably coupled to the system bus interfaceand to the array of memory cells, said memory operation manager beingconfigured to carry out memory program and memory read operations on thearray and comprising a command decoder configured to detect commandsreceived on the tag bus interface and with said memory operation managerbeing configured to interpret data received on the data bus interfacebased upon commands detected on the tag bus interface.
 2. The memorydevice of claim 1 wherein the system bus interface further includes astrobe signal interface and wherein the memory operation manager isfurther configured to interpret information on the tag bus interface andon the data bus interface at a time based upon a strobe signal receivedon the strobe signal interface.
 3. The memory device of claim 1 whereinthe memory operation manager comprises a program data block and whereinmemory operation manager is configured to load data present on the databus interface into the program data block in response to detection of aprogram data command on the tag bus interface by the command detector,with said memory operation manager being configured to program the datain the program data block into the array during the memory programoperations.
 4. The memory device of claim 1, wherein the memoryoperation manager includes a control register block which contain aplurality of control parameters used to control the memory program andread operations and wherein the memory operation manager is configuredto load data on the data bus interface into the control register blockin response to detection by the command decoder of a load controlregister command on the tag bus interface.
 5. The memory device of claim4 wherein the control register block includes a plurality of controlregisters, with each control register having an associated registeraddress and wherein the memory operation manager is configured to selectone of the control registers for loading data into the selected controlregister and for reading data out of the selected control register inresponse to detection of a select control register command on the tagbus interface and based upon a control register address received on thedata bus interface.
 6. The memory device of claim 5 wherein the memoryoperation manager is further configured to transfer data on the data businterface to a one of the control registers previously selected inresponse to detection of a control register write command on the tag businterface.
 7. The memory device of claim 6 wherein the memory operationmanager is further configured to transfer data present in one of thecontrol registers previously selected to the data bus interface inresponse to detection of a control register read command on the tag businterface.
 8. The memory device of claim 7 wherein the memory operationmanager is further configured to set the control registers to a resetstate in response to detection of a reset control register command onthe tag bus interface.
 9. The memory device of claim 8 wherein thememory device is switchable between a low and a normal power consumptionmode and wherein the memory operation manager is configured to switchthe memory device to the low power mode when the control registers arein the reset state.
 10. A memory device comprising: a system businterface to be coupled to a system bus which includes a tag bus and adata bus, with the system bus interface including a tag bus interfaceand a data bus interface; an array of memory cells; a memory operationmanager operably coupled to the system bus interface and to the array ofmemory cells, said memory operation manager being configured to carryout memory program and memory read operations on the array andcomprising a command decoder configured to detect commands received onthe tag bus interface, with the memory operation manager including aplurality of control registers for storing control parameters used tocontrol the memory read and program operations, with the memoryoperation manager being configured to transfer data present on the databus into the control registers in response to detection of a controlregister write command on the tag bus interface.
 11. The memory deviceof claim 10 wherein the memory operation manager is configured to selectone of the control registers prior to the transfer of data into thecontrol register in response to detection by the command decoder of acontrol register select command on the tag bus interface.
 12. The memorydevice of claim 11 wherein each of the control registers has anassociated address and wherein the memory operation manager isconfigured to select one of the control registers based upon a controlregister address received on the data bus interface.
 13. The memorydevice of claim 12 wherein the system bus interface includes a strobesignal interface and wherein the memory operation manager is configuredto interpret the control register select command and the controlregister address at a time determined by a strobe signal present on thestrobe signal bus.
 14. The memory device of claim 13 the memoryoperation manager is configured to interpret the control register writecommand on the tag bus interface and the data present on the data businterface at a time determined by a strobe signal present on the strobesignal bus.
 15. The memory device of claim 14 wherein the memoryoperation manager is configured to transfer data present in one of thecontrol registers to the data bus interface in response to detection ofa control register read command on the tag bus.
 16. The memory device ofclaim 15 wherein the memory operation manager is configured to transferdata present in one of the control registers previously selected usingthe control register select command.
 17. The memory device of claim 10wherein the memory operation manager is configured to control amagnitude of at least one voltage applied to the array during the memoryread and memory program operation based upon a plurality of the controlparameters.
 18. A memory device, comprising: a system bus interface tobe coupled to a system bus which includes a tag bus and a data bus, thesystem bus interface including a tag bus interface and a bi-directionaldata bus interface respectively connected to the tag bus and the databus; an array of memory cells; a memory operation manager operablycoupled to the system bus interface and to the array of memory cells,the memory operation manager being configured to carry out memoryprogram and memory read operations on the array, the memory operationmanager including a command decoder configured to detect commandsreceived on the tag bus interface and an address comparator configuredto compare a local address for the memory device to an address receivedon the system bus interface, the memory operation manager beingconfigured to interpret data received on the data bus interface basedupon commands detected on the tag bus interface.
 19. The memory deviceof claim 18, wherein the memory operation manager switches the memorydevice to a device enabled state when the command decoder and theaddress comparator indicate that one of a device select command isdetected on the system bus interface and an address on the system businterface matches the local address.
 20. The memory device of claim 19,wherein the system bus interface includes a strobe signal interface, andwherein the memory operation manager is configured to interpretinformation on the tag bus interface and on the data bus interface at atime based upon a strobe signal received on the strobe signal interface.21. The memory device of claim 18, wherein the memory operation managerincludes a program data block and is configured to load data present onthe data bus interface into the program data block in response todetection of a program data command on the tag bus interface by thecommand detector, the memory operation manager being configured toprogram the data in the program data block into the array during thememory program operations.
 22. The memory device of claim 18, whereinthe memory operation manager includes a control register block whichcontains a plurality of control parameters used to control the memoryprogram and read operations, and wherein the memory operation manager isconfigured to load data on the data bus interface into the controlregister block in response to detection by the command decoder of a loadcontrol register command on the tag bus interface.
 23. The memory deviceof claim 22, wherein the control register block includes a plurality ofcontrol registers, each control register having an associated registeraddress, and wherein the memory operation manager is configured toselect one of the plurality of control registers for loading data into aselected one of the plurality of control registers and for reading dataout of the selected control register in response to detection of aselect control register command on the tag bus interface and based upona control register address received on the data bus interface.
 24. Thememory device of claim 23, wherein the memory operation manager isconfigured to transfer data on the data bus interface to one of thecontrol registers previously selected in response to detection of acontrol register write command on the tag bus interface.
 25. The memorydevice of claim 24, wherein the memory operation manager is configuredto transfer data present in one of the control registers previouslyselected to the data bus interface in response to detection of a controlregister read command on the tag bus interface.
 26. The memory device ofclaim 25, wherein the memory operation manager is configured to set thecontrol registers to a reset state in response to detection of a resetcontrol register command on the tag bus interface.
 27. The memory deviceof claim 26, wherein the memory device is switchable between a low and anormal power consumption mode, and wherein the memory operation manageris configured to switch the memory device to the low power mode when thecontrol registers are in the reset state.
 28. A memory device,comprising: a system bus interface to be coupled to a system bus whichincludes a tag bus and a data bus, the system bus interface including atag bus interface and a bi-directional data bus interface; an array ofmemory cells; and a memory operation manager operably coupled to thesystem bus interface and to the array of memory cells, the memoryoperation manager being configured to carry out memory operations on thearray, the memory operation manager including a local address, a commanddecoder and an address comparator, the command decoder being configuredto detect commands received on the tag bus interface, the addresscomparator being configured to compare the local address to an addresson the system bus interface, and the memory operation manager beingconfigured to interpret data received on the data bus interface basedupon commands detected on the tag bus interface.
 29. The memory deviceof claim 28, wherein the address comparator produces a device enablesignal with the local address matching the address on the system businterface.
 30. The memory device of claim 28, wherein the memoryoperation manager switches the memory device to a device-enabled statewhen the command decoder indicates that a device select command has beenreceived on the system bus interface and the address comparatorindicates that the address from the system bus interface matches thelocal address.
 31. The memory device of claim 28, wherein the memoryoperations include a memory write operation, and wherein the memoryoperation manager reads a memory write command from the tag businterface and reads memory write data from the data bus interface. 32.The memory device of claim 28, wherein the memory operations include amemory read operation, and wherein the memory operation manager reads amemory read command from the tag bus interface and reads memory readaddress from the data bus interface.
 33. The memory device of claim 28,wherein the tag bus interface is un-directional.
 34. A memory devicehaving an enabled state and a disabled state, comprising: a system businterface to be coupled to a system bus which includes a tag bus and adata bus, the system bus interface including a tag bus interface and abi-directional data bus interface; an array of memory cells; and amemory operation manager operably coupled to the system bus interfaceand to the array of memory cells, the memory operation manager beingconfigured to carry out memory operations on the array, the memoryoperation manager including a local address, a command decoder and anaddress comparator, the command decoder being configured to detectcommands received on the tag bus interface, the address comparator beingconfigured to compare the local address to an address on the system businterface, and the memory operation manager being configured to switchthe memory device to the enabled state when the command decoder and theaddress comparator indicate that a device select command is detected onthe system bus interface and an address on the system bus interfacematches the local address.
 35. The memory device of claim 34, whereinthe memory operation manager includes a memory address register whichstores the address on the system bus interface for memory operations onthe array.
 36. The memory device of claim 35, wherein the device selectcommand is on the tag bus interface and a device select address is onthe data bus interface.
 37. The memory device of claim 36, wherein thememory operation manager includes a command register and memory dataregister, the memory operation manager reading a memory operation datacommand on the tag bus interface and transferring the memory operationdata command to the command register, the memory operation managerreading a memory operation data on the data bus interface andtransferring the memory operation data to the memory data register. 38.A memory device having an enabled state and a disabled state,comprising: a system bus interface to be coupled to a system bus whichincludes a tag bus and a data bus, the system bus interface including atag bus interface and a bi-directional data bus interface; an array ofmemory cells; and a memory operation manager operably coupled to thesystem bus interface and to the array of memory cells, the memoryoperation manager being configured to carry out memory operations on thearray, the memory operation manager including a local address, a commanddecoder and an address comparator, the command decoder being configuredto detect commands received on the tag bus interface, the addresscomparator being configured to compare the local address to an addresson the system bus interface, and the memory operation manager beingconfigured to switch the memory device to the disabled state when thecommand decoder indicates a deselect command is present on the systembus interface and the address comparator indicates that an address onthe system bus interface matches the local address.
 39. The memorydevice of claim 38, wherein the deselect command is on the tag businterface.
 40. The memory device of claim 38, wherein the address is onthe data bus interface.
 41. The memory device of claim 38, wherein thememory operation manager is configured to switch the memory device tothe enabled state when the command decoder and the address comparatorindicate that a device select command is detected on the system businterface and an address on the system bus interface matches the localaddress.
 42. A memory device having an enabled state and a disabledstate, comprising: a system bus interface to be coupled to a system buswhich includes a tag bus and a data bus, the system bus interfaceincluding a tag bus interface and a bi-directional data bus interface;an array of memory cells; and a memory operation manager operablycoupled to the system bus interface and to the array of memory cells,the memory operation manager being configured to carry out memoryoperations on the array, the memory operation manager including a localaddress, a command decoder and an address comparator, the commanddecoder being configured to detect commands received on the tag businterface, the address comparator being configured to compare the localaddress to an address on the system bus interface, and the memoryoperation manager being configured to hold the memory device in thedisabled state when the address comparator indicates that an address onthe system bus interface is different than the local address.
 43. Thememory device of claim 42, wherein the memory operation manager isconfigured to switch the memory device to the enabled state when thecommand decoder and the address comparator indicate that a device selectcommand is detected on the system bus interface and an address on thesystem bus interface matches the local address.
 44. The memory device ofclaim 42, wherein the address on the system bus interface is on the databus interface.
 45. The memory device of claim 44, wherein the memoryoperation manager includes registers for storing one of the address onthe data bus interface and the commands on the tag bus interface.
 46. Amemory device having an enabled state and a disabled state, comprising:a system bus interface to be coupled to a system bus which includes atag bus and a data bus, the system bus interface including a tag businterface and a bi-directional data bus interface, the tag bus interfacebeing configured to hold a common device select/de-select command withthe data bus interface holding a control indicating whether the commondevice select/de-select command is a device select signal or a devicede-select signal; an array of memory cells; and a memory operationmanager operably coupled to the system bus interface and to the array ofmemory cells, the memory operation manager being configured to carry outmemory operations on the array, the memory operation manager including alocal address, a command decoder and an address comparator, the commanddecoder being configured to detect commands received on the tag businterface and control bits on the data bus interface, the addresscomparator being configured to compare the local address to an addresson the system bus interface, the memory operation manager beingconfigured to switch the memory device to the disabled state when thecommand decoder indicates the deselect signal is present on the systembus interface, the memory operation manager being further configured toswitch the memory device to the enabled state when the command decoderindicates the select signal is present on the system bus and the addresscomparator indicates that an address on the system bus interface matchesthe local address.
 47. The memory device of claim 46, wherein theaddress and the control bit are present on the data bus interface at thesame time.